Method for producing optoelectronic components, and products produced thereby

Abstract

The production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which optical components are respectively provided, picked up and mounted on a wafer, the optical components preferably respectively being positioned individually or in groups relative to the position of assigned optoelectronic or optical components of the wafer or of a wafer to be connected thereto.

What is claimed is: 
     
         1 - 18 . (canceled) 
     
     
         19 . A method for producing optoelectronic components, the method comprising:
 connecting a functional wafer with a multiplicity of optoelectronic circuits to a glass, glass ceramic and/or optoceramic wafer that has a multiplicity of optical components, an optical component being respectively assigned to an optoelectronic circuit;   producing the optical components in the glass, glass ceramic and/or optoceramic wafer by dry etching in a plasma; and   producing the structures of the optical components on the wafer by applying a structured intermediate layer and removing both material of the intermediate layer and material of the glass, glass ceramic and/or optoceramic wafer by the reactive ions during the etching process.   
     
     
         20 . The method as claimed in  claim 19 , characterized in that the intermediate layer is structured photolithographically. 
     
     
         21 . The method as claimed in  claim 19 , characterized in that fluorine-containing atmosphere is used for producing a plasma for reactive ion etching an a glass, glass ceramic and/or optoceramic wafer with a material is used that at least contains one component, which forms a volatile fluoride with fluorine. 
     
     
         22 . The method as claimed in  claim 19 , characterized in that the glass contains at least one of the components of SiO 2 , GeO 2 , B 2 O 3 , P 2 O 5 . 
     
     
         23 . The method as claimed in  claim 19 , in which glass covers for the optoelectronic circuits are mounted on a functional wafer with a multiplicity of optoelectronic circuits, a glass, glass ceramic and/or optoceramic wafer being connected to a sacrificial substrate, and the glass, glass ceramic and/or optoceramic wafer being divided into individual covers that are interconnected via the sacrificial wafer, and the composite with the sacrificial wafer and the covers being fastened on the functional wafer with the exposed sides of the covers, and the connection between the sacrificial wafer and the covers being undone and the sacrificial wafer being removed such that an intermediate product is obtained with the functional wafer and covers that are fastened on the optoelectronic circuits and are laterally spaced apart from one another. 
     
     
         24 . The method as claimed in  claim 19  wherein a functional wafer or chips and a glass, glass ceramic and/or optoceramic wafer or covers are used, whose coefficients of thermal expansion differ at room temperature by at least 3.5*10 −6  K −1  or at least by 8*10 −6  K −1  or at least by 14*10 −6  K −1 . 
     
     
         25 . The method as claimed in  claim 19  characterized in that a glass wafer or glass covers having a spectrally filtering glass are used. 
     
     
         26 . The method as claimed in  claim 19  characterized in that a glass wafer or glass covers with a spectrally active coating is used. 
     
     
         27 . The method as claimed in  claim 19  wherein use is made of a glass wafer or glass covers having spectrally filtering glass and a spectrally active coating. 
     
     
         28 . The method as claimed in  claim 19  wherein use is made of a glass wafer or glass covers and optical components and/or cavities are produced by blank pressing the glass. 
     
     
         29 . The method as claimed in  claim 19  characterized in that a batch of a least two glass, glass ceramic and/or optoceramic wafers, at least one of which comprises a plurality of optical components, which in their positions are assigned to optoelectronic components on a functional wafer, is used. 
     
     
         30 . The method as claimed in  claim 19  wherein use is made of a glass, glass ceramic and/or optoceramic wafer with a multiplicity of lenses. 
     
     
         31 . The method as claimed in  claim 19  wherein use is made of a glass, glass ceramic and/or optoceramic wafer having optical components, the optical components being produced by blank pressing. 
     
     
         32 . The method as claimed in  claim 31 , characterized in that blank pressing is effected by means of a silicon press mold. 
     
     
         33 . The method as claimed in  claim 19  wherein depressions are produced on an optical wafer or individual transparent covers by blank pressing, and the wafer or the individual transparent covers are connected to a functional wafer so as to form cavities that hermetically enclose the sensor and/or emitter regions of the functional wafer. 
     
     
         34 . The method as claimed in  claim 19  characterized in that a glass, glass ceramic and/or optoceramic wafer having optical components is used, wherein the optical components are mounted on the glass, glass ceramic and/or optoceramic wafer. 
     
     
         35 . An intermediate product produced in accordance with the method as claimed in  claim 19 . 
     
     
         36 - 37 . (canceled) 
     
     
         38 . The intermediate product as claimed in  claim 35 , wherein individual chips having optoelectronic circuits are mounted on a transparent wafer having optical components and the chips are individually aligned relative to the position of assigned optical components of the wafer. 
     
     
         39 . (canceled) 
     
     
         40 . An optoelectronic module produced from the intermediate product as claimed in  claim 35 . 
     
     
         41 . A digital image recorder having the optoelectronic module as claimed in  claim 40 .