Flux Composition and Techniques for Use Thereof

Abstract

The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

What is claimed is: 
     
         1 . A soldering method for joining objects, comprising the steps of:
 applying a flux composition to at least a portion of one or more of the objects, the flux composition comprising:
 an activator; and 
 a solvent being a glycerol ethoxylate with a molecular weight of 200-500; and 
   joining the objects.   
     
     
         2 . The method of  claim 1 , further comprising:
 applying a solder compound with the flux composition to at least a portion of one or more of the objects.   
     
     
         3 . The method of  claim 2 , wherein the solder compound comprises a Pb-free solder. 
     
     
         4 . The method of  claim 1 , wherein applying a flux composition to at least a portion of one or more of the objects comprises spray-applying the flux to a laminate. 
     
     
         5 . The method of  claim 1 , wherein said joining comprises introducing the objects to heat, wherein the heat comprises a range from about 220° C. to about 275° C. 
     
     
         6 . The method of  claim 1 , further comprising:
 removing flux residue formed during joining, wherein removing flux residue formed during joining comprises using water to remove flux residue.   
     
     
         7 . The method of  claim 6 , wherein the water has a temperature of a range of about 40° C. to about 85° C. 
     
     
         8 . The method of  claim 1 , wherein the activator comprises acids that contain one or more carboxylic acid groups, and wherein the acids comprise one of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, diglycolic acid, diethylenetriamine pentaacetic acid, tartaric acid, poly(acrylic acid), and a keto acid including one of levulinic acid, acetyl butyric acid, 2-acetylbenzoic acid, 2-acetyloxybenzoic acid, 2-ketobutyric acid, acetoxyacetic acid, and pyruvic acid or a mixture thereof. 
     
     
         9 . A soldering method for joining objects, comprising the steps of:
 applying a flux composition to at least a portion of one or more of the objects, the flux composition comprises:
 an activator; 
 a solvent being a glycerol ethoxylate with a molecular weight of 200-500; and 
 an amine; and 
   joining the objects.   
     
     
         10 . The method of  claim 9 , further comprising:
 applying a solder compound with the flux composition to at least a portion of one or more of the objects.   
     
     
         11 . The method of  claim 10 , wherein the solder compound comprises a Pb-free solder. 
     
     
         12 . The method of  claim 9 , wherein applying a flux composition to at least a portion of one or more of the objects comprises spray-applying the flux to a laminate. 
     
     
         13 . The method of  claim 9 , wherein said joining comprises introducing the objects to heat, wherein the heat comprises a range from about 220° C. to about 275° C. 
     
     
         14 . The method of  claim 9 , further comprising:
 removing flux residue formed during joining, wherein removing flux residue formed during joining comprises using water to remove flux residue.   
     
     
         15 . The method of  claim 14 , wherein the water has a temperature of a range of about 40° C. to about 85° C. 
     
     
         16 . The method of  claim 9 , wherein the activator comprises acids that contain one or more carboxylic acid groups, and wherein the acids comprise one of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, diglycolic acid, diethylenetriamine pentaacetic acid, tartaric acid and poly(acrylic acid), and a keto acid including one of levulinic acid, acetyl butyric acid, 2-acetylbenzoic acid, 2-acetyloxybenzoic acid, 2-ketobutyric acid, acetoxyacetic acid, and pyruvic acid or a mixture thereof. 
     
     
         17 . The method of  claim 9 , wherein the amine is soluble in water and viscous. 
     
     
         18 . The method of  claim 9 , wherein the amine comprises one of tetrakis(2-hydroxypropyl)ethylenediamine (Quadrol®), (2-hydroxyethyl)ethylenediamine or triethanolamine.