Devices and methods for handling microelectronics assemblies

Abstract

The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

1 - 18 . (canceled) 
     
     
         19 . handling device for microelectronic assemblies, comprising:
 a frame including a first end portion, a second end portion spaced along a longitudinal axis from the first end portion, a first side portion coupling the first and second end portions, and a second side portion coupling the first and second end portions and spaced along a lateral axis from the first side portion;   an insert releasably disposed on the frame and including a plurality of pockets, with individual pockets positioned to releasably receive a respective one of the microelectronic assemblies; and   a retainer positioned to secure and release the insert with respect to the frame.   
     
     
         20 . A handling device for microelectronic assemblies, comprising:
 a frame being injection molded as a unitary construction of a homogeneous material, the frame including   a first end portion;   a second end portion spaced along a longitudinal axis from the first end portion;   a first side portion coupling the first and second end portions; and   a second side portion coupling the first and second end portions and spaced along a lateral axis from the first side portion;   wherein the first end portion, the second end portion, the first side portion and the second side portion combine to form a platform, form a rim surrounding the platform, and define an aperture;   an insert panel being vacuum molded and removably disposed across the aperture and inside of the rim, wherein the insert panel includes   a peripheral region overlying the platform; and   a central region having a plurality of pockets, with individual pockets positioned to releasably receive a respective microelectronic assemblies; and   a retainer positioned to secure and release the insert panel and the frame, the retainer having a coupled configuration with respect to the frame to secure the insert panel to the frame, and the retainer having a decoupled configuration with respect to the frame to release the insert panel from the frame.