Semiconductor lighting module package

Abstract

A semiconductor lighting module package includes a substrate, a lead frame located on the substrate, and a semiconductor lighting element. The lead frame has a carrier portion and a connecting portion spaced from the carrier portion. The semiconductor lighting element is electrically connected with the carrier portion and the connecting portion respectively. A plurality of nanoscale reflectors are formed on the carrier portion. A plurality of nanoscale reflectors are formed on the connecting portion. Shapes of the nanoscale reflectors formed on the carrier portion are different from shapes of the nanoscale reflectors formed on the connecting portion.

What is claimed is: 
     
         1 . A semiconductor lighting module package, comprising:
 a substrate;   a lead frame located on the substrate, the lead frame having a carrier portion and a connecting portion spaced from the carrier portion;   a semiconductor lighting element electrically connecting with the carrier portion and the connecting portion respectively; and   wherein a plurality of nanoscale reflectors are formed on the carrier portion, a plurality of nanoscale reflectors are formed on the connecting portion, and shapes of the nanoscale reflectors formed on the carrier portion are different from shapes of the nanoscale reflectors formed on the connecting portion.   
     
     
         2 . The semiconductor lighting module package of  claim 1 , wherein a plurality of nanoscale reflectors are formed on a surface of the substrate located between the carrier portion and the connecting portion. 
     
     
         3 . The semiconductor lighting module package of  claim 2 , wherein shapes of the nanoscale reflectors formed on the substrate are different from shapes of the nanoscale reflectors formed on either the carrier portion or connecting portion. 
     
     
         4 . The semiconductor lighting module package of  claim 1 , wherein a distance between every two of the nanoscale reflectors has a distance which is less than a half wavelength of a visible light. 
     
     
         5 . The semiconductor lighting module package of  claim 4 , wherein a gap between the every two of the plurality of nanoscale reflectors has a depth, and a ratio of the depth over the distance is not less than 2. 
     
     
         6 . The semiconductor lighting module package of  claim 1 , wherein the nanoscale reflectors are metal. 
     
     
         7 . The semiconductor lighting module package of  claim 1 , wherein the nanoscale reflectors are trapezoid, inverted trapezoid, elliptical, semicircular, pyramidical, inverted pyramidical or rectangular. 
     
     
         8 . A semiconductor lighting module package, comprising:
 a carrier portion;   a first connecting portion;   a second connecting portion; and   a semiconductor lighting element, the carrier portion, the first connecting portion and the second connecting portion being electrically insulated from each other, the semiconductor lighting element being arranged on the carrier portion and electrically connected to the first connecting portion and the second connecting portion respectively; wherein a plurality of nanoscale reflectors are formed on the first connecting portion, a plurality of nanoscale reflectors are formed on the second connecting portion, and shapes of nanoscale reflectors formed on the first connecting portion are different from shapes of nanoscale reflectors formed on the second connecting portion.   
     
     
         9 . A semiconductor lighting module package, comprising:
 a lead frame having a carrier portion, a first connecting portion and a second connecting portion;   a first semiconductor lighting element and a second semiconductor lighting element located on the carrier portion and electrically connected to the carrier portion and the first connecting portion and the second connecting portion respectively; and   wherein a plurality of nanoscale reflectors are formed on the carrier portion, a plurality of nanoscale reflectors are formed on first connecting portion, and shapes of nanoscale reflectors formed on the carrier portion are different from shapes of nanoscale reflectors formed on the first connecting portion.   
     
     
         10 . The semiconductor lighting module package of  claim 9 , wherein a plurality of nanoscale reflectors are formed on the second connecting portions. 
     
     
         11 . The semiconductor lighting module package of  claim 10 , wherein shapes of the nanoscale reflectors formed on the second connecting portion are different from shapes of the nanoscale reflectors formed on the first connecting portion. 
     
     
         12 . The semiconductor lighting module package of  claim 10 , wherein shapes of the nanoscale reflectors formed on the second connecting portion are different from shapes of the nanoscale reflectors formed on the carrier portion.