System and process for producing a metallic article

Abstract

According to one or more embodiments, a hot-stamping device includes first and second die portions including an alloy of metal M, the alloy of metal M having higher heat conductivity than ferrous alloy, and a cooling circuit in communication with at least one of the first and second die portions. The metal M may be copper. The alloy of metal M may include greater than 50 percent by weight of metal M. The first and second die portions may each independently include a greater than 50 percent by weight of the alloy of metal M.

What is claimed is: 
     
         1 . A hot-stamping device comprising:
 first and second die portions including an alloy of metal M, the alloy of metal M having higher heat conductivity than ferrous alloy; and   a cooling circuit in communication with at least one of the first and second die portions.   
     
     
         2 . The hot-stamping device of  claim 1 , wherein the metal M is copper. 
     
     
         3 . The hot-stamping device of  claim 1 , wherein the alloy of metal M includes greater than 50 percent by weight of metal M. 
     
     
         4 . The hot-stamping device of  claim 1 , wherein the first and second die portions each independently include a greater than 50 percent by weight of the alloy of metal M. 
     
     
         5 . The hot-stamping device of  claim 1 , wherein the first and second die portions include first and second surface sections, respectively, the first and second surface sections together defining a cavity and each independently including the alloy of metal M. 
     
     
         6 . The hot-stamping device of  claim 5 , wherein the first and second die portions include first and second body sections adjacent the first and second surface sections, respectively, the first and second body sections independently including at least 20 percent by weight of the alloy of metal M less than the first and second surface sections, respectively. 
     
     
         7 . The hot-stamping device of  claim 1 , wherein the cooling circuit includes a number of cooling channels contacting at least one of the first and second die portions. 
     
     
         8 . The hot-stamping device of  claim 5 , wherein the cooling circuit includes a number of cooling channels contacting at least one of the first and second surface sections. 
     
     
         9 . The hot-stamping device of  claim 8 , wherein the number of cooling channels includes ferrous alloy. 
     
     
         10 . The hot-stamping device of  claim 1 , wherein the alloy of metal M includes at least one of beryllium, tin and zinc. 
     
     
         11 . A hot-stamping device comprising:
 first and second die portions each including a copper alloy, the copper alloy including greater than 50 percent by weight of copper; and   a cooling circuit in communication with at least one of the first and second die portions.   
     
     
         12 . The hot-stamping device of  claim 11 , the first and second die portions each independently include greater than 50 percent by weight of the copper alloy. 
     
     
         13 . The hot-stamping device of  claim 11 , wherein the first and second die portions include first and second surface sections, respectively, the first and second surface sections together defining a cavity and each independently including the copper alloy. 
     
     
         14 . The hot-stamping device of  claim 13 , wherein the first and second die portions include first and second body sections adjacent the first and second surface sections, respectively, the first and second body sections independently including at least 20 percent by weight of the copper alloy less than the first and second surface sections, respectively. 
     
     
         15 . The hot-stamping device of  claim 11 , wherein the cooling circuit includes a number of cooling channels including ferrous alloy and contacting at least one of the first and second die portions. 
     
     
         16 . The hot-stamping device of  claim 14 , wherein the cooling circuit includes a number of cooling channels including ferrous alloy and contacting at least one of the first and second surface sections. 
     
     
         17 . A method of hot-stamping, comprising:
 subjecting a metallic part to a cavity defined by first and second die portions, at least one of the first and second die portions including an alloy of metal M, the alloy of metal M having a higher heat conductivity than ferrous alloy.   
     
     
         18 . The method of  claim 17 , further comprising contacting at least one of the first and second die portions including the alloy of metal M with a number of cooling channels. 
     
     
         19 . The method of  claim 18 , further comprising forming the number of cooling channels via casting. 
     
     
         20 . The method of  claim 17 , further comprising contacting the metallic part with both of the first and second die portions to effect compression.