Highly filled high thermal conductive material, method for manufacturing same, composition, coating liquid and molded article

Abstract

[Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article. [Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm 2 ; and to cooling and solidification.

1 . A high filler-loaded high thermal conductive material, formed by subjecting a composition which comprises organic polymer particles comprising a thermoplastic polymer and a thermally conductive filler having a graphite-like structure, and comprises 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained by using a pulverizing machine so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm 2 ; and cooling and solidification. 
     
     
         2 . The high filler-loaded high thermal conductive material according to  claim 1 , wherein the pulverizing machine is a ball mill. 
     
     
         3 . The high filler-loaded high thermal conductive material according to  claim 1 , wherein the thermoplastic polymer contains at least one selected from the group consisting of a thermoplastic resin and a thermoplastic elastomer, all of which have crystallinity and/or aromaticity. 
     
     
         4 . The high filler-loaded high thermal conductive material according to  claim 1 , wherein the thermoplastic polymer contains at least one selected from the group consisting of polyphenylene sulfide, polyethylene terephthalate, polybutylene terephthalate, and polycarbonate. 
     
     
         5 . The high filler-loaded high thermal conductive material according to  claim 1 , wherein the organic polymer particles further contain an uncured thermosetting resin. 
     
     
         6 . The high filler-loaded high thermal conductive material according to  claim 5 , wherein the uncured thermosetting resin contains at least one selected from benzoxazine. 
     
     
         7 . The high filler-loaded high thermal conductive material according to  claim 1 , wherein the thermally conductive filler contains graphite. 
     
     
         8 . The high filler-loaded high thermal conductive material according to  claim 7 , wherein the graphite contains natural graphite and/or artificial graphite. 
     
     
         9 . The high filler-loaded high thermal conductive material according to  claim 7 , wherein the graphite contains scale-like graphite. 
     
     
         10 . The high filler-loaded high thermal conductive material according to  claim 7 , wherein the high filler-loaded high thermal conductive material has a thermal conductivity of 10 to 150 W/mK,
 a coefficient of thermal expansion of 3×10 −6  to 30×10 −6 ° C. −1 , and   a surface electrical conductivity of 5 to 200 (Ωcm) −1 .   
     
     
         11 . The high filler-loaded high thermal conductive material according to  claim 1 , wherein the thermally conductive filler contains thermally conductive ceramics. 
     
     
         12 . The high filler-loaded high thermal conductive material according to  claim 1 , wherein the thermally conductive ceramics contains hexagonal boron nitride. 
     
     
         13 . The high filler-loaded high thermal conductive material according to  claim 11 , wherein the high filler-loaded high thermal conductive material has a thermal conductivity of 5 to 50 W/mK,
 a coefficient of thermal expansion of 3×10 −6  to 30×10 −6 ° C. −1 , and   an electrical conductivity of 10 −10  (Ωcm) −1  or less.   
     
     
         14 . A high filler-loaded composition, which comprises organic polymer particles comprising a thermoplastic polymer and an uncured thermosetting resin, and a thermally conductive filler having a graphite-like structure, comprises 5 to 60% by weight of the organic polymer particles, 40 to 95% by weight of the thermally conductive filler having a graphite-like structure, and 0 to 6% by weight of the uncured thermosetting resin relative to 100% by weight of the total amount of these components, is obtained by using a pulverizing machine so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster. 
     
     
         15 . A coating liquid comprising the high filler-loaded composition according to  claim 14 , and a dispersing medium. 
     
     
         16 . A molded article, comprising the high filler-loaded high thermal conductive material according to  claim 1 , and being used as a high thermal conduction/heat dissipation component. 
     
     
         17 . The molded article according to  claim 16 , wherein the molded article is formed by laminating two layers of the high filler-loaded high thermal conductive material;
 one layer of the two layers has a thermal conductivity of 15 to 120 W/mK and a coefficient of thermal expansion of 3×10 −6  to 30×10 −6 ° C. −1 , and exhibits electrical conductivity with a surface electrical conductivity of 10 to 200 (Ωcm) −1 ; and   the other layer of the two layers has a thermal conductivity of 5 to 50 W/mK or more and a coefficient of thermal expansion of 3×10 −6  to 10×10 −6 ° C. −1 , and exhibits insulating properties with a surface electrical conductivity of 10 −11  (Ωcm) −1  or less.   
     
     
         18 . The molded article according to  claim 17 , wherein the layers of the high filler-loaded high thermal conductive material is formed of a gradient material.