Method for fabricating an implantable electrode
Abstract
A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.
Claims
exact text as granted — not AI-modified1 - 2 . (canceled)
3 . The method of claim 21 wherein the mechanical roughening of the electrode surface comprises grit blasting.
4 . The method of claim 3 wherein the grit blasting is performed using an alumina oxide media.
5 . The method of claim 21 wherein the cleaning of the roughened electrode surface is carried out.
6 . The method of claim 5 wherein the cleaning comprises ultrasonic cleaning.
7 . The method of claim 21 wherein the sputtering process parameters are optimized to minimize post-pulse polarization
8 . The method of claim 7 wherein the sputtering process parameters, optimized to minimize post-pulse polarization, include a target power.
9 . The method of claim 8 wherein the target power is about 300 Watts.
10 . The method of claim 7 wherein the sputtering parameters optimized to minimize post-pulse polarization include a sputtering pressure.
11 - 12 . (canceled)
13 . The method of claim 21 wherein the adhesion layer comprises a metal selected from the group of titanium and zirconium.
14 . The method of claim 5 the cleaning comprises ion-etching the roughened electrode surface prior to depositing the adhesion layer.
15 - 20 . (canceled)
21 . A method for fabricating an implantable medical electrode, the method consisting essentially of:
mechanically roughening a surface of the substrate; optionally cleaning the roughened substrate surface; applying an adhesion layer to the roughened substrate surface; and applying a metal oxide coating directly on the adhesion layer on the roughened surface using sputtering in a sputtering atmosphere comprising a 25% ratio of oxygen to argon.
22 . The method of claim 21 , wherein the metal oxide coating comprises iridium.
23 . The method of claim 21 , wherein the metal oxide coating comprises ruthenium.Join the waitlist — get patent alerts
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