Electrode for electrolytic plating and electrolytic plating apparatus including the same

Abstract

Disclosed are an electrode for electrolytic plating and an electrolytic plating apparatus including the same. A contact area between a surface of an object to be plated and an electrode can be minimized using an electrode for electrolytic plating having a non-conductive pattern partially formed thereon. Generation of a metal composite having multiple cores due to simultaneous contact between plural objects to be plated and the conductive region being not covered with non-conductive pattern can be prevented. Since the surface of the object to be plated can be coated with different kinds of metals before galvanic corrosion occurs, a metal composite having a core-shell structure can have improved reliability, quality and stability. Various different kinds of metals can be coated onto the surface of the object to be plated without limitation as the object to be plated.

What is claimed is: 
     
         1 . An electrode for electrolytic plating comprising:
 a non-conductive pattern partially formed on a surface of a conductive material,   wherein an exposed surface of the conductive material being not covered with non-conductive pattern is brought into contact with an object to be plated so as to achieve plating on a surface of the object to be plated.   
     
     
         2 . The electrode for electrolytic plating according to  claim 1 , wherein the exposed surface of the conductive material being not covered with non-conductive pattern is prevented from simultaneously contacting plural objects to be plated. 
     
     
         3 . The electrode for electrolytic plating according to  claim 1 , wherein the exposed surface of the conductive material being not covered with non-conductive pattern is formed in a mesh or opening shape having a size 0.5 to 2 times a diameter of the object to be plated. 
     
     
         4 . The electrode for electrolytic plating according to  claim 1 , wherein the conductive material is an electroconductive metal. 
     
     
         5 . The electrode for electrolytic plating according to  claim 4 , wherein the electroconductive metal comprises at least one selected from the group consisting of Ag, Au, Al, Ni, Cu, and Pt. 
     
     
         6 . The electrode for electrolytic plating according to  claim 1 , wherein the conductive material has at least one shape selected from the group consisting of a sheet shape, a wire shape, a disc shape, a rod shape, and a foil shape. 
     
     
         7 . The electrode for electrolytic plating according to  claim 1 , wherein the non-conductive pattern has at least one shape selected from the group consisting of a mesh shape, a stripe shape, a spiral shape, and a spherical shape. 
     
     
         8 . The electrode for electrolytic plating according to  claim 1 , wherein the non-conductive pattern is an embossed pattern. 
     
     
         9 . The electrode for electrolytic plating according to  claim 1 , wherein the non-conductive pattern is formed by coating at least one material selected from the group consisting of non-conductive metallic oxide, methylpentene polymer, polyamide, polytetrafluoroethylene, polyethylene, polypropylene, polyisoprene, polyurethane, polycarbonate, polyimide, polystyrene, polysulfone, polyvinylchloride, and polyvinylidene chloride. 
     
     
         10 . The electrode for electrolytic plating according to  claim 1 , wherein a ratio of a total area of non-conductive regions generated by the non-conductive pattern formed on the surface of the conductive material to a total area of conductive regions being not covered with non-conductive pattern is 20:80 to 95:5. 
     
     
         11 . The electrode for electrolytic plating according to  claim 1 , wherein the conductive material has engraved regions formed on the surface thereof, and the non-conductive pattern is formed by coating a non-conductive material on the engraved regions. 
     
     
         12 . The electrode for electrolytic plating according to  claim 1 , wherein the object to be plated is a metal powder. 
     
     
         13 . An electrolytic plating apparatus comprising:
 a reaction chamber;   an electrode for electrolytic plating according to  claim 1 , the electrode for electrolytic planting being disposed in the reaction chamber; and   a power source for applying voltage to the electrode for electrolytic plating.   
     
     
         14 . The electrolytic plating apparatus according to  claim 13 , wherein the reaction chamber includes an agitation unit. 
     
     
         15 . The electrolytic plating apparatus according to  claim 13 , wherein the reaction chamber is a cylindrical barrel, and the electrode for electrolytic plating is disposed along an inner peripheral surface of the cylindrical barrel type reaction chamber.