Method for producing a flexible circuit configuration, flexible circuit configuration, and electrical circuit configuration having such a flexible circuit configuration

Abstract

For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.

1 - 13 . (canceled) 
     
     
         14 . A flexible circuit configuration containing a layer sequence and an insulating film (TF, GF), which abuts flatly on the layer sequence and is connected thereto, wherein
 the layer sequence comprises at least one insulating layer and at least one structured conductive layer having terminal surfaces, and   the insulating film is structured in such a way that it has contact surfaces on its outer side facing away from the layer sequence, which are electrically connected via through contacts through perforations of the insulating film to terminal surfaces of the layer sequence,   the through contacts are implemented through the insulating film as contact material, which is deposited in the openings and directly on the terminal surfaces.   
     
     
         15 . The flexible circuit configuration according to  claim 14 , wherein the contact material of the through contacts is continued as a uniform layer into the contact surfaces. 
     
     
         16 . The flexible circuit configuration according to  claim 14 , wherein the layer of the layer sequence resting as a cover layer on the insulating film is an insulating layer. 
     
     
         17 . The flexible circuit configuration according to  claim 16 , wherein the terminal surfaces are implemented in a conductive layer, which is separated from the insulating film at least by the cover layer. 
     
     
         18 . The flexible circuit configuration according to  claim 17 , wherein the perforations through the insulating film are continued as openings through the insulating film up to terminal surfaces in the layer sequence. 
     
     
         19 . The flexible circuit configuration according to  claim 14 , wherein the insulating film is glued to the layer sequence. 
     
     
         20 . The flexible circuit configuration according to  claim 14 , wherein the layer sequence contains at least two conductive layers, which are separated from one another by at least one insulating layer as a separation layer and are electrically connected via through contacts through the separation layer. 
     
     
         21 . The flexible circuit configuration according to  claim 14 , wherein the layer sequence is deposited on the insulating film (GF). 
     
     
         22 . The flexible circuit configuration according to  claim 14 , wherein one or more insulating layers of the layer sequence and/or the insulating film comprise a polymer, in particular a polyimide. 
     
     
         23 . An electrical circuit configuration which, on a circuit board, contains a flexible circuit configuration according to  claim 14  and conductor paths and conductive connections between the conductor paths and contact surfaces of the insulating film. 
     
     
         24 . The flexible circuit configuration according to  claim 14 , wherein the insulating film (TF) is deposited on the layer sequence.