US2015299407A1PendingUtilityA1
Fast cure epoxy resin systems
Est. expiryDec 21, 2032(~6.4 yrs left)· nominal 20-yr term from priority
Inventors:Chris Harrington
B32B 2307/50C08J 5/042C08L 2205/06C08J 2463/04B32B 37/182C08L 63/00C08J 2363/02C08L 2205/02B32B 2262/106B32B 2262/101B32B 2262/06B32B 2307/718B32B 2260/046B32B 5/22C08J 2471/10B32B 2255/02B32B 2260/021C08L 2205/03C08J 2363/00B32B 2262/08B32B 27/08B32B 2603/00B32B 2262/0269B32B 2605/18B32B 2262/02B32B 2605/08B32B 2305/076B32B 5/08B32B 2262/10B32B 2255/205C08G 59/4021B32B 2305/08B32B 5/26B32B 2250/20B32B 2262/14C08J 5/24C08J 5/249C08J 5/243C08G 59/18
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Claims
Abstract
A fast cure epoxy resin system is provided that upon curing has a Tg no greater than 140° C. and a Phase angle below 20° at a temperature of 140° C. or below, and prepregs and mouldings based on the system. The resin formulation matches the reactivity of the resin to the amount of curative and hardener employed.
Claims
exact text as granted — not AI-modified1 . An epoxy resin formulation containing a curative, the formulation being curable at 150° C. in no more than 150 seconds, and being curable at 120° C. in no more than 4 minutes to provide a cured resin having Tg no greater than 140° C.
2 . An epoxy resin formulation according to claim 1 having a Phase angle when cured of below 20″ at a temperature below 140° C.
3 . An epoxy resin according to claim 2 in which the Phase angle is below 15°.
4 . An epoxy resin formulation according to claim 1 comprising from 4 to 10 wt % based on the weight of the epoxy resin of one or more urea based curing agents.
5 . An epoxy resin formulation according to claim 1 comprising from 7% to 10% of a hardener.
6 . An epoxy resin formulation according to claim 5 in which the hardener is dicyandiamide.
7 . An epoxy resin formulation according to claim 2 in which the epoxy resin has a functionality of at least 2.
8 . An epoxy resin formulation according to claim 1 in which the epoxy resin has a storage modulus G′ of from 3×10 5 Pa to 1×10 8 Pa and a loss modulus G″ of from 2×10 6 Pa to 1×10 8 Pa at a temperature of 20° C.
9 . An epoxy resin formulation according to claim 1 in which the epoxy resin has a complex viscosity of from 5×10 5 Pa to 1×10 7 Pa·s at a temperature of 20° C.
10 . A prepreg comprising fibrous reinforcement and an epoxy resin formulation according to claim 1 .
11 . A prepreg according to claim 10 in which the resin content by volume of the uncured prepreg is in the range of from 15 to 70% by volume of the prepreg.
12 . A prepreg according to claim 10 in which the fibrous reinforcement comprises cracked, selectively discontinuous or continuous filaments.
13 . A prepreg according to claim 10 in which the filaments. are made from carbon, basaltic fibre, graphite, glass, metalized polymers, aramid, natural fibres and/or mixtures thereof.
14 . A process for the production of laminar structures by laying up a stack of layers of prepregs according to claim 10 and causing the stack to cure.
15 . A stack of prepregs containing an epoxy resin of functionality at least 2 and an EEW from 150 to 1500 and containing a curative the resin being curable by an externally applied temperature at 150° C. in no more than 150 seconds to provide a cured resin haying a Tg no greater than 140° C.,
16 . A stack of prepregs according to claim 15 in which the epoxy resin formulation has a Phase angle when cured of less than 20° at temperatures of 140° C. or below.
17 . A laminar structure comprising a cured stack of prepregs according to claim 15 .Cited by (0)
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