Kind of light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and their preparation methods

Abstract

A kind of light-heat dual curing anisotropic conductive adhesive includes light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent 12.0-16.0%, wherein the components are counted according to weight percentage. The present invention also discloses a kind of light-heat dual curing anisotropic conductive film (ACF) and its preparation methods. Ultraviolet light curing method is applied to produce ACF can avoid using solvent to protect the natural environment. When using ACF, heat curing method is then applied to guarantee the quality of banding and the reliability.

What is claimed is: 
     
         1 . A kind of light-heat dual curing anisotropic conductive adhesive including: light curing activated monomer 15.0-18.0° %, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent 12.0-16.0%, wherein the above-mentioned components are counted according to weight percentage. 
     
     
         2 . The light-heat dual curing anisotropic conductive adhesive according to the  claim 1 , wherein said conductive adhesive furtherly includes plasticizer whose weight percentage is 3.0-6.0%. 
     
     
         3 . The light-heat dual curing anisotropic conductive adhesive according to the  claim 1 , wherein said conductive adhesive furtherly includes coupling agent whose weight percentage is 0.5-1.0%. 
     
     
         4 . The light-heat dual curing anisotropic conductive adhesive according to the  claim 1 , wherein said conductive adhesive furtherly includes leveling agent whose weight percentage is 0.5-1.5%. 
     
     
         5 . The light-heat dual curing anisotropic conductive adhesive according to the  claim 1 , wherein said conductive adhesive furtherly includes antioxidant whose weight percentage is 0.5-1.0%. 
     
     
         6 . A kind of light-heat dual curing anisotropic conductive film comprising a plastic film basic material and a conductive adhesive layer, and a kind of light-heat dual curing anisotropic conductive adhesive being coated on the plastic film basic material and then being cured with ultraviolet light to form said conductive adhesive layer;
 Said light-heat dual curing anisotropic conductive adhesive consisting of light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, plasticizer 3.0-6.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0%, latent heat curing agent 12.0-16.0%, coupling agent 0.5-1.0%, leveling agent 0.5-1.5% and antioxidant 0.5-1.0%, wherein the above-mentioned components are counted according to weight percentage.   
     
     
         7 . The light-heat dual curing anisotropic conductive film according to the  claim 6 , wherein the conductive film furtherly comprises a protective film that is covered on the conductive adhesive layer. 
     
     
         8 . The light-heat dual curing anisotropic conductive film according to the  claim 6 , wherein the material of the above-mentioned plastic film basic material is polyethylene terephthalate. 
     
     
         9 . The light-heat dual curing anisotropic conductive film according to the  claim 7 , wherein the material of the above-mentioned plastic film basic material is polyethylene terephthalate.