Methods for Fabricating Metal Structures Incorporating Dielectric Sheets

Abstract

Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate dielectric material and/or wherein seed layer material used to allow deposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.

We claim: 
     
         1 . A batch method of fabricating a plurality of three dimensional structures, comprising:
 a) providing a substrate;   b) forming a plurality of multi-material layers, directly or indirectly on the substrate, with each layer representing a selected cross-section of the three-dimensional structure, wherein the forming of at least two consecutive layers comprise:
 i. depositing a conductive material as part of a first of the at least two layers; 
 ii. depositing at least one dielectric material as part of a first of the at least two layers; 
 iii) electrolessly depositing a conductive material onto the dielectric material to form at least part of a second of the at least two layers. 
   
     
     
         2 . The method of  claim 1  wherein the dielectric material is selectively deposited. 
     
     
         3 . The method of  claim 2  wherein the selectively depositing is performed without use of a masking material. 
     
     
         4 . The method of  claim 2  wherein the selective depositing occurs via inkjet dispensing. 
     
     
         5 . The method of  claim 1  additionally comprising the step of activating the surface of the dielectric material prior to electrolessing depositing. 
     
     
         6 . The method of  claim 1  additionally comprising the step of selectively activating the surface of the dielectric material prior to electrolessing depositing relative to at least one other surface of the first of the at least two layers. 
     
     
         7 . The method of  claim 1  additionally comprising the planarization of the first of the at least two layers prior to forming part of the second of the at least two layers. 
     
     
         8 . The method of  claim 1  additionally comprising etching the surface of the dielectric material prior to electroless depositing to enhance a roughness of a surface of the dielectric material. 
     
     
         9 . The method of  claim 1  wherein the dielectric material is a structural material. 
     
     
         10 . The method of  claim 1  wherein the conductive material and the dielectric material are structural materials. 
     
     
         11 . The method of  claim 11  wherein formation of the first of the at least two layers further comprises depositing a sacrificial material. 
     
     
         12 . The method of  claim 11  additionally comprising the removal of the sacrificial material after formation of a plurality of layers. 
     
     
         13 . A batch method of fabricating three dimensional structures, comprising:
 a) providing a substrate;   b) forming a plurality of multi-material layers, directly or indirectly on the substrate, with each layer representing a selected cross-section of the three-dimensional structure, wherein the forming of at least one layer comprises:
 i. selectively depositing a first dielectric material; 
 ii. depositing a second dielectric material; 
 iii. depositing a conductive material; 
   c) catalyzing at least one of the dielectric materials with an electroless plating catalyst, and   d) selectively depositing metal onto the catalyzed dielectric material.