Power Converter

Abstract

The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.

1 . A power converter, comprising:
 a semiconductor module that comprises a power semiconductor element to convert DC power to AC power;   an AC-side connecting conductor that transmits the AC power; and   a passage forming body that is constructed of a thermally conductive member and forms a coolant passage through which coolant flows, wherein   the passage forming body is provided with a through hole for communicating the AC-side connecting conductor therein.   
     
     
         2 . The power converter according to  claim 1 , further comprising:
 a case that defines a housing space for housing the semiconductor module and is provided with an opening portion, wherein   the opening portion of the case is closed by the passage forming body in a state in which the semiconductor module is housed in the housing space of the case.   
     
     
         3 . The power converter according to  claim 2 , wherein
 the AC-side connecting conductor comprises a U-phase connecting conductor, a V-phase connecting conductor and a W-phase connecting conductor, and   the passage forming body is provided with a first through hole for communicating the U-phase connecting conductor, a second through hole for communicating the V-phase connecting conductor and a third through hole for communicating the W-phase connecting conductor.   
     
     
         4 . The power converter according to  claim 3 , wherein
 the first through hole, the second through hole and the third through hole are arranged along a direction in which the coolant flows.   
     
     
         5 . The power converter according to  claim 2 , further comprising:
 an AC terminal holder that holds the AC-side connecting conductor, wherein   the semiconductor module is disposed at one side of the passage forming body and the AC terminal holder is disposed at another side of the passage forming body, opposite to the semiconductor module via the passage forming body.   
     
     
         6 . The power converter according to  claim 2 , wherein
 the semiconductor module is disposed at one side of the passage forming body,   the passage forming body is provided with an opening that communicates with the passage at the side of the passage forming body where the semiconductor module is disposed,   the semiconductor module is provided with a heat transfer plate on which the power semiconductor element is mounted via an insulating substrate, and   the heat transfer plate closes the opening so as to directly contact with the coolant.