Production of thin silicone films

Abstract

Thin silicon films of high thickness uniformity and thicknesses of from 0.1 μm to 200 μm are prepared by applying a crosslinkable silicone composition to a moving carrier by means of a slot die, removing solvent, if present, and subsequently crosslinking the silicone layer formed on the carrier.

1 - 4 . (canceled) 
     
     
         5 . A method for the continuous production of a thin silicone film having a film thickness of 0.1 to 200 μm and a thickness precision of ±5% measured over an area of 200 cm 2 , comprising:
 i) applying a crosslinkable, solvent-containing or solvent-free silicone composition (X) through the gap of a slot die onto a moving carrier, 
 ii) subsequently removing solvent, if present, from a silicone layer which forms on the carrier, and crosslinking the silicone layer, 
 iii) wherein after crosslinking, the resulting crosslinked silicone film is partable from the carrier, and
 a) the slot die in step i) is at an angle of between 10° and 90° to the carrier; 
 b) the travel speed of the carrier is between 0.1 and 1000 m/min; and 
 c) the dynamic viscosity of the silicone composition (X) as measured according to DIN53019 is between 100 mPa·s and 100 Pa·s.