Flexural plate wave device for chip cooling

Abstract

Methods, systems, and apparatuses are described for cooling electronic devices. The electrical device includes an integrated circuit die (IC) having opposing first and second surfaces, a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate, and a flexural plate wave device. The flexural plate wave device is configured to generate a stream of air to flow across the electrical device to cool the IC die during operation of the IC die.

What is claimed is: 
     
         1 . An electrical device, comprising:
 an integrated circuit (IC) die having opposing first and second surfaces;   a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate;   a flexural plate wave device configured to generate an acoustic wave through at least a portion of the flexural plate wave device, the acoustic wave causing vortexes of air to be pumped across the electrical device to cool the IC die during operation of the IC die.   
     
     
         2 . The electrical device of  claim 1 , wherein the flexural plate wave device is on the first surface of the IC die. 
     
     
         3 . The electrical device of  claim 1 , further comprising:
 a cooling device having opposing first and second surfaces, wherein the cooling device is coupled to the IC die, and the flexural plate wave device is on the first surface of the cooling device.   
     
     
         4 . The electrical device of  claim 3 , further comprising:
 a plurality of support members coupled between the first surface of the cooling device and the first surface of the IC die that mount the cooling device to the IC die and form a channel between the IC die and the cooling device;   wherein the vortexes of air are pumped through the channel.   
     
     
         5 . The electrical device of  claim 4 , wherein the second surface of the cooling device has a recessed region. 
     
     
         6 . The electrical device of  claim 3 , wherein the second surface of the cooling device is attached to the first surface of the IC die;
 wherein the vortexes of air flow across the first surface of the cooling device.   
     
     
         7 . The electrical device of  claim 1 , wherein the flexural plate wave device comprises:
 a base layer;   a support layer coupled to the base layer;   a diaphragm layer coupled to the support layer, the support layer including an opening to form an air gap between the base layer and the diaphragm layer;   a piezoelectric material layer coupled to the diaphragm layer; and   a wave generator formed on the piezoelectric material layer that is configured to generate the acoustic wave.   
     
     
         8 . The electrical device of  claim 7 , wherein the wave generator comprises:
 a first comb-shaped electrically conductive feature; and   a second comb-shaped electrically conductive feature electrically isolated from and interlocked with the first comb-shaped electrically conductive feature;   wherein a first oscillating signal is coupled to the first comb-shaped electrically conductive feature, and a second oscillating signal is coupled to the second comb-shaped electrically conductive feature.   
     
     
         9 . The electrical device of  claim 7 , further comprising:
 a wave absorber formed on the piezoelectric material layer configured to receive and absorb the acoustic wave to at least reduce a reflection of the acoustic wave through the piezoelectric material layer.   
     
     
         10 . The electrical device of  claim 9 , wherein the wave absorber comprises:
 a first comb-shaped electrically conductive feature; and   a second comb-shaped electrically conductive feature interlocked with the first comb-shaped electrically conductive feature.   
     
     
         11 . The electrical device of  claim 10 , wherein the second comb-shaped electrically conductive feature is electrically coupled to the first comb-shaped electrically conductive feature. 
     
     
         12 . A cooling device, comprising:
 a body that has opposing first and second surfaces; and   a flexural plate wave device on the first surface that is configured to generate an acoustic wave through at least a portion of the flexural plate wave device, the acoustic wave causing vortexes of air to be pumped across the cooling device to cool an integrated circuit (IC) during operation of the integrated circuit (IC).   
     
     
         13 . The cooling device of  claim 12 , wherein the body is an IC die, and the second surface is an active surface of the IC die. 
     
     
         14 . The cooling device of  claim 12 , further comprising:
 a plurality of support members on the first surface of the body configured to mount the cooling device to an IC die and form a channel between the IC die and the cooling device;   wherein the vortexes of air are pumped through the channel.   
     
     
         15 . The cooling device of  claim 14 , wherein the second surface of the body has a recessed region. 
     
     
         16 . The cooling device of  claim 12 , wherein the second surface of the body is configured to be attached to an IC die. 
     
     
         17 . The cooling device of  claim 12 , wherein the flexural plate wave device comprises:
 a support layer coupled to the body;   a diaphragm layer coupled to the support layer, the support layer including an opening to form an air gap between the body and the diaphragm layer;   a piezoelectric material layer coupled to the diaphragm layer; and   a wave generator formed in contact with the piezoelectric material layer that is configured to generate the acoustic wave.   
     
     
         18 . The cooling device of  claim 17 , wherein the wave generator comprises:
 a first comb-shaped electrically conductive feature; and   a second comb-shaped electrically conductive feature electrically isolated from and interlocked with the first comb-shaped electrically conductive feature;   wherein a first oscillating signal is coupled to the first comb-shaped electrically conductive feature, and a second oscillating signal is coupled to the second comb-shaped electrically conductive feature.   
     
     
         19 . The cooling device of  claim 17 , further comprising:
 a wave absorber formed in contact with the piezoelectric material layer configured to receive and absorb the acoustic wave to prevent the acoustic wave from reflecting through the piezoelectric material layer.   
     
     
         20 . A method, comprising:
 operating an integrated circuit (IC) of an electrical device that generates heat during operation; and   generating an acoustic wave with a flexural plate wave device of the electrical device, the acoustic wave causing vortexes of air to be pumped across the electrical device to cool the IC during operation of the IC.