Device for nail applique transfer, sheet of nail appliques and method for nail applique transfer

Abstract

Disclosed is a die-cut device for nail applique transfer. The device includes a thin film element having a proximal end, a distal end opposite the proximal end, and a lower surface and forming a nail applique. The device includes an adhesive layer disposed on the lower surface of the thin film element and an application tab detachably attached to a portion of the adhesive layer adjacent to the distal end of the thin film element. The adhesive layer has a first portion and a second portion. The first portion of the adhesive layer is adjacent to the distal end of the thin film element and is covered with the application tab. The second portion of the adhesive layer remains exposed for transfer of the nail applique to a fingernail or toenail. The application tab is suitable for a user to grasp when the nail applique is transferred to the fingernail or toenail.

What is claimed is: 
     
         1 . A device for transferring a nail applique to a fingernail or toenail, comprising:
 a thin film element having a proximal end, a distal end opposite the proximal end, and a lower surface and forming a nail applique;   an adhesive layer disposed on the lower surface of the thin film element; and   an application tab detachably attached to a portion of the adhesive layer adjacent to the distal end of the thin film element,   wherein the adhesive layer has a first portion and a second portion, the first portion of the adhesive layer is adjacent to the distal end of the thin film element and is covered with the application tab, the second portion of the adhesive layer remains exposed for transfer of the nail applique to a fingernail or toenail, the application tab is suitable for a user to grasp when the nail applique is transferred to the fingernail or toenail.   
     
     
         2 . The device according to  claim 1 , wherein the application tab has one end matching the distal end of the thin film element. 
     
     
         3 . The device according to  claim 1 , wherein the application tab comprises a connection portion adapted to cover the first portion of the adhesive layer adjacent to the distal end of the thin film element and an extension portion extending outward from the distal end of the thin film element and suitable for a user to grasp when the nail applique is transferred to the fingernail or toenail. 
     
     
         4 . The device according to  claim 1 , wherein the application tab has at least one bending line along which the tab is bent during transfer of the nail applique. 
     
     
         5 . The device according to  claim 4 , wherein the bending line comprises a crease formed on the lower surface of the tab opposite the adhesive layer and the crease extends in the direction from the proximal end of the thin film element to the distal end of the thin film element. 
     
     
         6 . The device according to  claim 1 , wherein the application tab comprises a body portion, a neck portion extending outward from the body portion, and a head portion opposite the body portion and extending outward from the neck portion, the neck portion comprising a narrow band extending outward from the body portion to the head portion, the head portion having a wider shape than the band to allow a user to grasp the tab. 
     
     
         7 . The device according to  claim 3 , wherein the application tab comprises a body portion forming the connection portion, a neck portion, and a head portion, together with the neck portion, forming the extension portion, the neck portion comprising a narrow band extending outward from the body portion to the head portion, the head portion having a wider shape than the band to allow a user to grasp the tab. 
     
     
         8 . A sheet of nail appliques comprising:
 a substrate having an upper surface forming a detachable support surface and at least one cut-out portion at least partially cut out of the substrate;   thin film elements detachably supported on the upper surface of the substrate and forming nail appliques; and   adhesive layers, each of which is disposed on the lower surface of the corresponding nail applique,   wherein the nail applique comprises a lower surface facing the upper surface of the substrate, a distal end, and a proximal end opposite the distal end, the proximal end overlaps the cut-out portion of the substrate, and the adhesive layer has a first portion arranged between the cut-out portion of the substrate and the lower surface of the nail applique at the distal end and a second portion arranged between the upper surface of the substrate and the lower surface of the nail applique at the proximal end outside the cut-out portion.   
     
     
         9 . The sheet according to  claim 8 , wherein the proximal end is directed outward from the center of the substrate. 
     
     
         10 . The sheet according to  claim 8 , wherein the proximal end is directed inward toward the center of the substrate. 
     
     
         11 . The sheet according to  claim 8 , wherein the distal end of the nail applique overlaps the connection portion of the cut-out portion, the extension portion of the cut-out portion of the substrate extends outward from the distal end of the nail applique, and the first portion of the adhesive layer is arranged between the connection portion of the cut-out portion of the substrate and the lower surface of the nail applique at the distal end. 
     
     
         12 . The sheet according to  claim 8 , wherein the cut-out portion of the substrate is separable from the substrate to form a device for transferring the nail applique to a fingernail or toenail, the device comprising an application tab formed by the cut-out portion separated from the substrate, the nail applique supported on the cut-out portion and, together with the cut-out portion, removed from the substrate, and the adhesive layer having a second portion exposed when the nail applique is removed from the substrate. 
     
     
         13 . The sheet according to  claim 8 , wherein the cut-out portion of the substrate is defined by a die-cut partially extending along the periphery of the cut-out portion. 
     
     
         14 . The sheet according to  claim 8 , wherein the substrate comprises at least one holding tie that connects the cut-out portion to the other portion of the substrate outside the cut-out portion to fix the cut-out portion to the other portion of the substrate before removal of the cut-out portion from the substrate. 
     
     
         15 . The sheet according to  claim 8 , wherein the cut-out portion comprises at least one bending line along which the cut-out portion is bent after removal of the cut-out portion from the substrate. 
     
     
         16 . The sheet according  claim 15 , wherein the bending line comprises a crease formed on the lower surface of the cut-out portion opposite the adhesive layer and the crease extends from the proximal end of the thin film element to the distal end of the thin film element. 
     
     
         17 . The sheet according to  claim 8 , wherein the cut-out portion comprises a body portion, a neck portion extending outward from the body portion, and a head portion opposite the body portion and extending outward from the neck portion, the neck portion comprising a narrow band extending outward from the body portion to the head portion, the head portion having a wider shape than the band to allow a user to grasp the cut-out portion. 
     
     
         18 . The sheet according to  claim 8 , wherein the sheet comprises a plurality of cut-out portions partially cut from the substrate and the distal end of the nail applique is supported on each of the cut-out portions. 
     
     
         19 . The sheet according to  claim 8 , wherein the substrate comprises a peripheral edge aligned with at least one portion of the proximal end of the nail applique. 
     
     
         20 . The sheet according to claim wherein the cut-out portion is arranged at the peripheral edge of the substrate. 
     
     
         21 . The sheet according to  claim 8 , wherein the cut-out portion is separable from the substrate by a pressure applied thereto from the lower surface of the substrate opposite the upper surface of the substrate. 
     
     
         22 . A method for transferring nail appliques to fingernails or toenails, comprising:
 providing adhesive layers detachably supported on a substrate to nail appliques, the substrate comprising cut-out portions partially cut from the substrate and the cut-out portions supporting the distal ends of the nail appliques thereon;   removing the cut-out portions, together with the nail appliques, forming application tabs adapted to support the distal ends of the nail appliques from the substrate, each of the adhesive layers having a first portion exposed when the corresponding nail applique is removed from the substrate;   aligning the proximal ends of the nail appliques opposite the distal ends with the cuticle edges of fingernails or toenails while holding the application tabs adapted to support the distal ends;   arranging the exposed adhesive layers on the fingernails or toenails to attach the proximal ends of the nail appliques to the fingernails or toenails; and   removing the application tabs from the distal ends of the nail appliques.   
     
     
         23 . The method according to  claim 22 , wherein the application tabs are removed from the distal ends of the nail appliques by exposing second portions of the adhesive layers at the distal ends of the nail appliques. 
     
     
         24 . The method according to  claim 22 , wherein the cut-out portions are removed from the substrate by cutting holding ties adapted to connect the cut-out portions to the other portions of the substrate. 
     
     
         25 . The method according to  claim 22 , further comprising bending the application tabs to adjust the nail appliques to the curvatures of the fingernails or toenails. 
     
     
         26 . The method according to  claim 25 , wherein the application tabs are bendable by bending lines formed on the cut-out portions of the substrate. 
     
     
         27 . The method according to  claim 26 , wherein the bending lines are creases formed on the surfaces of the cut-out portions.