Support for use in microchannel processing

Abstract

The disclosed technology relates to an apparatus, comprising: at least one microchannel, the microchannel comprising at least one heat transfer wall; a porous thermally conductive support in the microchannel in contact with the heat transfer wall; a catalyst or a sorption medium supported by the porous support; and a heat source and/or heat sink in thermal contact with the heat transfer wall.

1 - 125 . (canceled) 
     
     
         126 . An apparatus, comprising:
 at least one microchannel, the microchannel comprising at least one heat transfer wall;   a porous thermally conductive support in the microchannel in contact with the heat transfer wall;   a catalyst or a sorption medium supported by the porous support; and   a heat source or heat sink in thermal contact with the heat transfer wall;   the porous thermally conductive support comprising: one or more thermally conductive support strips, each support strip having a first side and a second side and a plurality of microgrooves formed in one or both sides; a composite structure containing multiple layers of one or more thermally conductive metals, silicon carbide, graphite, alumina, or a combination thereof; a macroporous layer comprising SiCN, SiC, TiO 2 , SiO 2 , ZrO 2 , or Al 2 O 3 ; sol gel deposited SiO 2 , Al 2 O 3  or TiO 2 ; surfactant templated SiO 2 ; anodized Al 2 O 3 ; anodized TiO 2 ; Al 2 O 3  nanotubes; TiO 2  nanotubes; carbon nanotubes; multiwall nanotubes; single wall nanotubes; or zeolites; or   the porous thermally conductive support and the heat transfer wall comprising: a sintered metal powder on a sheet of solid metal; or a porous layer of pure metal on a solid sheet of metal alloy; or   the porous thermally conductive support and the catalyst comprising: at least three length scales to reduce transport resistance while maintaining a low pressure drop per unit length; Pt/Al 2 O 3  nanofibers; a carbon nanotube-Co/SiO 2  composite; gold nanoparticles supported on carbon nanotubes; or metal nanowires in Al 2 O 3  or TiO 2  nanotubes.   
     
     
         127 . The apparatus of  claim 126  wherein a gap is positioned in the microchannel adjacent to the porous support. 
     
     
         128 . The apparatus of  claim 126  wherein the microchannel has an another interior wall opposite the heat transfer wall and another porous support contacting the another interior wall, the catalyst or sorption medium being supported by the another porous support. 
     
     
         129 . The apparatus of  claim 128  wherein the another interior wall is another heat transfer wall. 
     
     
         130 . The apparatus of  claim 128  wherein a gap is positioned in the microchannel between the porous support and the another porous support, the gap being of sufficient dimension to permit fluid to flow in the gap. 
     
     
         131 . The apparatus of  claim 126  wherein the microchannel has a plurality of interior walls and in at least part of the microchannel the porous support is in contact with each of the interior walls. 
     
     
         132 . The apparatus of  claim 131  wherein the microchannel further comprises a gap in the interior of the microchannel adjacent to the porous support. 
     
     
         133 . The apparatus of  claim 126  wherein the porous support has a thickness in the range from 0.25 to 10 mm. 
     
     
         134 . The apparatus of  claim 126  wherein the gap has a height in the range from 0.02 to 5 mm. 
     
     
         135 . The apparatus of  claim 127  wherein the porous support has a thickness, the ratio of the thickness of the porous support to the height of the gap being in the range from 0.1 to 20. 
     
     
         136 . The apparatus of  claim 126  wherein the microchannel has a bulk flow region adjacent the porous support and the porous support has a cross sectional area, the ratio of the cross sectional area of the bulk flow region to the cross sectional area of the microchannel being in the range from 0.01 to 10. 
     
     
         137 . The apparatus of  claim 126  wherein the porous support has an effective thermal conductivity greater than 0.7 W/m-K. 
     
     
         138 . The apparatus of  claim 126  wherein the porous support has a tortuosity in the range from 1 to 10. 
     
     
         139 . The apparatus of  claim 126  wherein the combination of porous support and heat transfer wall has a thermal conductivity in the range from 0.5 to 500 W/m-K. 
     
     
         140 . The apparatus of  claim 126  wherein at least 20% of the pore volume of the porous support comprises pores having an average size in the range from 0.1 to 700 microns. 
     
     
         141 . The apparatus of  claim 126  wherein the porous support comprises a coating layer having an average pore size in the range from 0.1 nanometer to 10 microns. 
     
     
         142 . The apparatus of  claim 126  wherein the porous support comprises the one or more thermally conductive support strips, at least some of the microgrooves being parallel to each other. 
     
     
         143 . The apparatus of  claim 142  wherein a plurality of the support strips are stacked one above the other, at least one of the support strips contacting the heat transfer wall. 
     
     
         144 . The apparatus of  claim 126  wherein the porous thermally conductive support comprises a thermally conductive support strip with a first surface and a second surface, a plurality of first microgrooves in the first surface, a plurality of second microgrooves in the second surface, at least some of the first microgrooves intersecting at least some of the second microgrooves to form a plurality of through holes in the support strip. 
     
     
         145 . The apparatus of  claim 144  wherein at least some of the first microgrooves are parallel to each other and at least some of the second microgrooves are parallel to each other. 
     
     
         146 . The apparatus of  claim 144  wherein at least some of the first microgrooves intersect at least some of the second microgrooves at right angles to each other. 
     
     
         147 . The apparatus of  claim 144  wherein:
 the first microgrooves are positioned in an array of first block patterns in the first surface and an array of second block patterns in the first surface, the first microgrooves in the first block pattern in the first surface being parallel to each other and aligned in a first direction, the first microgrooves in the second block pattern in the first surface being parallel to each other and aligned in a second direction, the first block pattern in the first surface being adjacent to the second block pattern in the first surface, the first direction in the first block pattern in the first surface being at a right angle to the second direction in the second block pattern in the first surface; 
 the second microgrooves are positioned in an array of first block patterns in the second surface and an array of second block patterns in the second surface, the second microgrooves in the first block pattern in the second surface being parallel to each other and aligned in a first direction, the second microgrooves in the second block pattern in the second surface being parallel to each other and aligned in a second direction, the first block pattern in the second surface being adjacent to the second block in the second surface pattern, the first direction in the first block pattern in the second surface being at a right angle to the second direction in the second block pattern in the second surface. 
 
     
     
         148 . The apparatus of  claim 144  wherein a plurality of the support strips are stacked one above the other, at least one of the support strips contacting the heat transfer wall. 
     
     
         149 . The apparatus of  claim 126  wherein the porous thermally conductive support comprises a thermally conductive support strip with a first surface, a plurality of microgrooves being formed in the first surface, at least some of microgrooves being parallel to each other. 
     
     
         150 . The apparatus of  claim 149  wherein at least some of the microgrooves partially penetrate the support strip. 
     
     
         151 . The apparatus of  claim 149  wherein at least some of the microgrooves penetrate all the way through the support strip to permit fluid to flow through the microgrooves. 
     
     
         152 . The apparatus of  claim 149  wherein the support strip has a length with a center axis extending along the length, a first side edge, a second side edge, a front edge extending from the first side edge to the second side edge, and a back edge extending from the first side edge to the second side edge, at least some of the microgrooves extending between the first side edge and the second side edge at an angle relative to the center axis to permit fluid to flow in the microgrooves in an angled direction toward the back edge or toward the front edge. 
     
     
         153 . The apparatus of  claim 149  wherein the thermally conductive support comprises a plurality of the thermally conductive support strips, the thermally conductive support strips being stacked one above the other, at least one of the thermally conductive support strips contacting the heat transfer wall. 
     
     
         154 . The apparatus of  claim 142  wherein the porous support comprises a composite support structure, the thermally conductive support strip being a first support strip, the composite support structure-further comprising a second support strip;
 the first support strip comprising a first surface, a second surface, a length with a center axis extending along the length, a front edge, a back edge, a first side edge, a second side edge, the front edge and the back edge extending from the first side edge and to the second side edge, a plurality of parallel microgrooves in the first surface extending from the front edge to the second side edge, and a plurality of parallel microgrooves in the first surface extending from first side edge to the back edge; 
 the second support strip comprising a first surface, a second surface, a length with a center axis extending along the length, a front edge, a back edge, a first side edge, a second side edge, the front edge and the back edge extending from the first side edge to the second side edge, a plurality of parallel microgrooves in the first surface extending from the front edge to the first side edge, and a plurality of parallel microgrooves in the first surface extending from second side edge to the back edge; 
 the first support strip being adjacent to the second support strip with the second surface of the first support strip contacting the first surface of the second support strip; 
 the front and back edges of each of the first and second support strips being open to permit fluid to flow through the front and back edges; 
 the side edges of each of the first and second support strips being closed to prevent fluid from flowing through the side edges; 
 the microgrooves in the first and second support strips penetrating through the first and second support strips to permit fluid to flow through the first and second support strips; 
 the microgrooves in the first surface of the first support strip being oriented toward the front edge and the first side edge of the first support strip and forming a first angle with the center axis; and 
 the microgrooves in the first surface of the second support strip being oriented toward the front edge and the first side edge of the second support strip and forming a second angle with the center axis, the first angle being different than the second angle to provide for crossings of microgrooves in first support strip with microgrooves in the second support strip. 
 
     
     
         155 . The apparatus of  claim 154  wherein the support structure further comprises end plates to prevent the flow of fluid out of the sides of the support structure. 
     
     
         156 . The apparatus of  claim 154  wherein the support structure comprises a plurality of the first support strips and a plurality of the second support strips, the first and second support strips being stacked one above the other or positioned side by side one another in alternating sequence. 
     
     
         157 . The apparatus of  claim 142  wherein the support strip has a thickness in the range from 0.1 to 5000 microns. 
     
     
         158 . The apparatus of  claim 142  wherein the microgrooves have a depth in the range up to 1000 microns. 
     
     
         159 . The apparatus of  claim 142  wherein the microgrooves have widths in the range up to 1000 microns. 
     
     
         160 . The apparatus of  claim 142  wherein the spacing between the microgrooves is in the range up to 1000 microns. 
     
     
         161 . The apparatus of  claim 142  wherein the microgrooves have cross sections in the shape of a square, rectangle, vee, semi-circle, dovetail or trapezoid. 
     
     
         162 . The apparatus of  claim 142  wherein the thermally conductive support is made of material comprising metal, silicon carbide, graphite, or a combination of two or more thereof. 
     
     
         163 . The apparatus of  claim 142  wherein the thermally conductive support is made of material comprising stainless steel or an alloy comprising iron, chromium, aluminum and yttrium. 
     
     
         164 . The apparatus of  claim 126  wherein the porous support is formed integrally with the heat transfer wall. 
     
     
         165 . The apparatus of  claim 126  wherein the porous support is grown on the heat transfer wall. 
     
     
         166 . The apparatus of  claim 126  wherein the porous support is formed on the heat transfer wall, the porous support being formed on the heat transfer wall by a process comprising:
 forming a first template to confine the porous support to the heat transfer wall; 
 filling the first template with a first templating solution comprising at least one polymer; 
 drying the first templating solution with the result being the formation of voids in the dried first templating solution; 
 filling the voids in the dried first templating solution with a second metal containing templating solution to provide a composite construction; 
 heating the composite construction in an oxidizing environment to remove the polymer with the result being the formation of a porous metallic structure adhered to the heat transfer wall. 
 
     
     
         167 . The apparatus of  claim 126  wherein the macroporous layer has an average pore size in the range from 50 nm to 1 micron. 
     
     
         168 . The apparatus of  claim 126  wherein the porous support comprises a layer comprising the Al 2 O 3  nanotubes, TiO 2  nanotubes, or carbon nanotubes, the average pore size of the layer being in the range from 2 nm to 50 nm. 
     
     
         169 . The apparatus of  claim 126  wherein the sol-gel deposited SiO 2 , Al 2 O 3  or TiO 2  comprises a layer having an average pore size in the range from 0.1 nm to 50 nm. 
     
     
         170 . The apparatus of  claim 126  wherein the surfactant templated SiO 2  comprises a layer having an average pore size in the range from 2 nm to 50 nm. 
     
     
         171 . The apparatus of  claim 126  wherein the zeolites are in a layer having an average pore size in the range from 0.1 nm to 2 nm. 
     
     
         172 . The apparatus of claim  26  wherein the porous support and the heat transfer wall comprise a laminate structure. 
     
     
         173 . The apparatus of  claim 172  wherein the laminate structure comprises a sheet of sintered stainless steel. 
     
     
         174 . The apparatus of  claim 172  wherein the laminate structure comprises multiple layers of porous material. 
     
     
         175 . The apparatus of  claim 172  wherein the laminate structure comprises a porous layer of nickel and a solid sheet of a nickel based alloy. 
     
     
         176 . The apparatus of  claim 126  wherein the catalyst is a graded catalyst. 
     
     
         177 . The apparatus of  claim 126  wherein the microchannel further comprises surface features on an interior wall of the microchannel for modifying the flow of fluid in the microchannel, the surface feature being recessed in or projecting from the interior wall. 
     
     
         178 . The apparatus of  claim 126  wherein surface features for modifying the flow of fluid are positioned on the porous support or on or in the heat transfer wall. 
     
     
         179 . The apparatus of  claim 126  wherein surface features for modifying flow are positioned on, in or within the porous support. 
     
     
         180 . The apparatus of  claim 177  wherein the surface features are positioned opposite the porous support. 
     
     
         181 . The apparatus of  claim 177  wherein the surface features and the porous support are positioned on the same wall. 
     
     
         182 . The apparatus of  claim 177  wherein the surface features are in the form of depressions in or projections from one or more of the microchannel interior walls that are oriented at oblique angles relative to the direction of flow of fluid through the microchannel. 
     
     
         183 . The apparatus of  claim 177  wherein the surface features are in the form of at least two surface feature regions wherein mixing of fluid is conducted in a first surface feature region followed by flow of the fluid in a second surface feature region wherein the flow pattern in the second surface feature region is different than the flow pattern in the first surface feature region. 
     
     
         184 . The apparatus of  claim 177  wherein the surface features comprise two or more layers stacked on top of each other or intertwined in a three-dimensional pattern. 
     
     
         185 . The apparatus of  claim 177  wherein the surface features are in the form of circles, oblongs, squares, rectangles, checks, chevrons, wavy shapes, or combinations thereof. 
     
     
         186 . The apparatus of  claim 177  wherein the surface features comprise sub-features where major walls of the surface features further contain smaller surface features in the form of notches, waves, indents, holes, burrs, checks, scallops, or combinations thereof. 
     
     
         187 . The apparatus of  claim 126  wherein the microchannel has one or more sidewalls and at least one apertured section in one or more of the sidewalls, the apertured section comprising an interior portion and a surface feature sheet that overlies the interior portion of the apertured section, surface features being in or on the surface feature sheet. 
     
     
         188 . The apparatus of  claim 126  wherein the apparatus is in the form of a microchannel reactor, the microchannel reactor comprising a plurality of the microchannels adapted to be operated in parallel, the microchannels being process microchannels, a header for providing for the flow of fluid into the microchannels, a footer for providing for the flow of fluid out of the microchannels, and the catalyst supported by the porous support. 
     
     
         189 . The apparatus of  claim 188  wherein a second reactant stream channel is adjacent each process microchannel and an apertured section for permitting the staged addition of one or more reactants into the process microchannel is positioned between the second reactant stream channel and the process microchannel. 
     
     
         190 . The apparatus of  claim 126  wherein the apparatus is in the form of an integrated combustion reactor comprising at least one reaction chamber and at least one combustion chamber, the reaction chamber or the combustion chamber comprising a plurality of the microchannels adapted to be operated in parallel. 
     
     
         191 . The apparatus of  claim 126  wherein the apparatus is in the form of a microchannel separator, the microchannel separator comprising a plurality of the microchannels adapted to be operated in parallel, a header for providing for the flow of fluid into the microchannels, a footer for providing for the flow of fluid out of the microchannels, at least one heat exchange channel for exchanging heat with the microchannels, and the sorption medium supported by the porous support. 
     
     
         192 . The apparatus of  claim 126  wherein the microchannel has an internal dimension of width or height of up to 10 mm. 
     
     
         193 . The apparatus of  claim 126  wherein the microchannel has an internal dimension of width or height of up to 2 mm. 
     
     
         194 . The apparatus of  claim 126  wherein the microchannel is made of a material comprising: steel; aluminum; titanium; nickel; copper; brass; an alloy of any of the foregoing metals; polymer; ceramics; glass; a composite comprising polymer and fiberglass; quartz; silicon; or a combination of two or more thereof. 
     
     
         195 . The apparatus of  claim 126  wherein a second reactant stream channel is adjacent to the microchannel, the second reactant stream channel having an internal dimension of width or height of up to 10 mm. 
     
     
         196 . The apparatus of  claim 195  wherein the second reactant stream channel is adjacent to the microchannel, the second reactant stream channel being made of a material comprising: steel; aluminum; titanium; nickel; copper; brass; an alloy of any of the foregoing metals; polymer; ceramics; glass; a composite comprising polymer and fiberglass; quartz; silicon; or a combination of two or more thereof. 
     
     
         197 . The apparatus of  claim 195  wherein the second reactant stream channel is adjacent to the microchannel, the microchannel and the second reactant stream channel having at least one common wall with an apertured section in the common wall. 
     
     
         198 . The apparatus of  claim 126  wherein the heat source or heat sink is adjacent to the microchannel. 
     
     
         199 . The apparatus of  claim 126  wherein the heat source or heat sink is remote from the microchannel. 
     
     
         200 . The apparatus of  claim 126  wherein the heat source or heat sink comprises at least one heat exchange channel. 
     
     
         201 . The apparatus of  claim 200  wherein the heat exchange channel comprises a heat exchange microchannel. 
     
     
         202 . The apparatus of  claim 200  wherein the heat exchange channel has an internal dimension of width or height of up to 10 mm. 
     
     
         203 . The apparatus of  claim 200  wherein the heat exchange channel has an internal dimension of width or height of up to 2 mm. 
     
     
         204 . The apparatus of  claim 200  wherein the heat exchange channel is made of a material comprising: steel; aluminum; titanium; nickel; copper; brass; an alloy of any of the foregoing metals; polymer; ceramics; glass; a composite comprising polymer and fiberglass; quartz; silicon; or a combination of two or more thereof. 
     
     
         205 . The apparatus of  claim 200  wherein the heat source or heat sink comprises at least one electric heating element, resistance heater or non-fluid cooling element. 
     
     
         206 . The apparatus of  claim 205  wherein the electric heating element, resistance heater or non-fluid cooling element is adjacent to the microchannel. 
     
     
         207 . The apparatus of  claim 205  wherein the microchannel comprises one or more walls and the electric heating element, resistance heater or non-fluid cooling element is part of at least one of the walls of the microchannel. 
     
     
         208 . The apparatus of  claim 205  wherein the microchannel comprises one or more walls and at least one of the walls of the process microchannel is formed from the electric heating element, resistance heater or non-fluid cooling element. 
     
     
         209 . The apparatus of  claim 200  wherein a heat exchange fluid is in the heat exchange channel. 
     
     
         210 . The apparatus of any one of  claim 126  wherein the microchannel is formed from parallel spaced sheets or plates. 
     
     
         211 . The apparatus of  claim 195  wherein the microchannel and the second reactant stream channel are formed from parallel spaced sheets and plates. 
     
     
         212 . The apparatus of  claim 200  wherein the heat exchange channel and the microchannel are formed from parallel spaced sheets or plates. 
     
     
         213 . A process for conducting a reaction in the microchannel reactor of  claim 191  comprising flowing a first reactant and a second reactant in the process microchannels in contact with the catalyst to form a product. 
     
     
         214 . The process of  claim 213  wherein the first reactant and the second reactant are mixed upstream of the process microchannel. 
     
     
         215 . The process of  claim 213  wherein the first reactant and the second reactant are mixed in the process microchannel. 
     
     
         216 . The process of  claim 213  wherein the first reactant and the second reactant are mixed in the header. 
     
     
         217 . The process of  claim 213  wherein the second reactant flows from a second reactant stream channel into the process microchannel. 
     
     
         218 . The process of  claim 213  wherein a reaction zone is in the process microchannel, the second reactant contacting the first reactant in the reaction zone. 
     
     
         219 . The process of  claim 213  wherein a mixing zone and a reaction zone are in the process microchannel, the mixing zone being upstream of the reaction zone, the second reactant contacting the first reactant in the mixing zone. 
     
     
         220 . The process of  claim 213  wherein a mixing zone and a reaction zone are in the process microchannel, the mixing zone being upstream of the reaction zone, part of the second reactant contacting the first reactant in the mixing zone, and part of the second reactant contacting the first reactant in the reaction zone. 
     
     
         221 . The process of  claim 213  wherein the heat source or heat sink comprises at least one heat exchange channel containing a heat exchange fluid, the heat exchange fluid undergoing a phase change in the heat exchange channel. 
     
     
         222 . The process of  claim 213  wherein the heat flux between the heat source or heat sink and the process microchannels are in the range from 0.01 to 500 watts per square centimeter of surface area of the process microchannels. 
     
     
         223 . The process of  claim 213  wherein the heat source or heat sink comprises at least one heat exchange channel, an endothermic process being conducted in the heat exchange channel. 
     
     
         224 . The process of  claim 213  wherein the heat source or heat sink comprises at least one heat exchange channel, an exothermic process being conducted in the heat exchange channel. 
     
     
         225 . The process of  claim 213  wherein the heat source or heat sink comprises at least one heat exchange channel, the reactants flow in the process microchannels in a first direction, and a heat exchange fluid flows in the heat exchange channel in a second direction, the second direction being cross current relative to the first direction. 
     
     
         226 . The process of  claim 213  wherein the heat source or heat sink comprises at least one heat exchange channel, the reactants flow in the process microchannel in a first direction, and a heat exchange fluid flows in the heat exchange channel in a second direction, the second direction being cocurrent or counter current relative to the first direction. 
     
     
         227 . The process of  claim 213  wherein the heat source or heat sink comprises at least one heat exchange channel, a heat exchange fluid is in the heat exchange channel, the heat exchange fluid comprising the first reactant, the second reactant, the product, or a mixture of two or more thereof. 
     
     
         228 . The process of  claim 213  wherein the heat source or heat sink comprises at least one heat exchange channel, a heat exchange fluid is in the heat exchange channel, the heat exchange fluid comprising one or more of air, steam, liquid water, carbon monoxide, carbon dioxide, gaseous nitrogen, liquid nitrogen, inert gas, gaseous hydrocarbon, oil, and liquid hydrocarbon. 
     
     
         229 . The process of  claim 213  wherein the reaction comprises one or more of the following reactions: acetylation addition, acylation, alkylation, dealkylation, hydrodealkylation, reductive alkylation, amination, ammonia synthesis, aromatization, arylation, autothermal reforming, carbonylation, decarbonylation, reductive carbonylation, carboxylation, reductive carboxylation, reductive coupling, condensation, cracking, hydrocracking, cyclization, cyclooligomerization, ammoxidation, water-gas shift, dehalogenation, dimerization, epoxidation, esterification, Fischer-Tropsch reaction, halogenation, hydrohalogenation, homologation, hydration, dehydration, hydrogenation, dehydrogenation, oxidative dehydrogenation, hydrocarboxylation, hydroformylation, hydrogenolysis, hydrometallation, hydrosilation, hydrolysis, hydrotreating, isomerization, methylation, demethylation, metathesis, methanol synthesis, nitration, oxidation, partial oxidation, polymerization, reduction, reformation, steam methane reforming reaction, reverse water gas shift, sulfonation, telomerization, transesterification, dimerizaiton, trimerization, oligmerization, Sabatier reaction, carbon dioxide reforming, preferential oxidation, preferential methanation, or a combination of two or more of the foregoing reactions. 
     
     
         230 . The process of  claim 213  wherein the heat source comprises at least one heat exchange channel, an endothermic reaction being conducted in the process microchannels and an exothermic reaction being conducted in the heat exchange channel. 
     
     
         231 . The process of  claim 230  wherein the endothermic reaction is a steam reforming reaction and the exothermic reaction is a combustion reaction. 
     
     
         232 . The process of  claim 213  wherein the temperature within the process microchannel is in the range from −40° C. to 1050° C. 
     
     
         233 . The process of  claim 213  wherein the pressure within the process microchannels is in the range up to 250 atmospheres absolute pressure. 
     
     
         234 . The process of  claim 213  wherein the contact time is in the range from 1 microsecond to 100 seconds. 
     
     
         235 . The process of  claim 213  wherein the pressure drop for the flow of reactants and product in the process microchannels is up to 20 atmospheres per meter of length of the process microchannel. 
     
     
         236 . The process of  claim 213  wherein the heat source or heat sink comprises at least one heat exchange channel, a heat exchange fluid being in the heat exchange fluid, the heat exchange fluid flowing in the heat exchange channel, the pressure drop for the heat exchange fluid flowing in the heat exchange channel being up to 1 atmosphere per meter of length of the heat exchange channel. 
     
     
         237 . The process of  claim 213  wherein the product is removed from the process microchannels, the process further comprising flowing a regenerating fluid through the process microchannels in contact with the catalyst. 
     
     
         238 . The process of  claim 213  wherein the reaction is an ultrafast reaction. 
     
     
         239 . The process of  claim 213  wherein a heat flux intensity for the process is determined, the heat flux intensity being in the range from 1000 to 800,000 W/m 2 -K. 
     
     
         240 . The process of  claim 213  wherein a mass flux intensity for the process is determined, the mass flux intensity being in the range from 1 to 20 moles/m 2 /sec. 
     
     
         241 . The process of  claim 213  wherein fluid flows through the porous support, the pressure drop of the fluid flowing through the porous support being less than 20%. 
     
     
         242 . The process of  claim 213  wherein the process comprises flowing the first reactant and the second reactant in the process microchannels in contact with the catalyst to form a product, the contact time being in the range from 0.4 to 4 ms, the heat flux being in the range from 10 to 100 W/cm 2 , and the pressure drop in the process microchannels being less than 15 atmospheres per meter. 
     
     
         243 . The process of  claim 213  wherein the process comprises flowing the first reactant and the second reactant in the process microchannels in contact with the catalyst to form a product, the contact time being in the range from 0.4 to 4 ms, the heat flux being in the range from 10 to 100 W/cm 2 , the pressure drop in the process microchannels being less than 15 atmospheres per meter, and the approach to equilibrium conversion being at least 75%.