Compound heat-dissipating device

Abstract

A compound heat-dissipating device includes a conductive base and a heat-dissipating body. The conductive base has a first bottom surface, a first top surface, and a plurality of combining portions protruded from the first top surface. Each combining portion has a bottom end connected with the first bottom surface and a top end extended from the bottom end integrally. The top end has a cross-sectional area bigger than that of the bottom end. The heat-dissipating body has a second bottom surface and a second top surface. The second bottom surface has a pair of concave portions corresponding to a contour of the conductive base, and a plurality of combining grooves formed in the concave portion. The shape of the combining grooves is corresponding to that of the combining portions, and the combining portions are correspondingly combined with the combining grooves.

What is claimed is: 
     
         1 . A compound heat-dissipating device, comprising:
 a conductive base, having a first bottom surface, a first top surface, and a plurality of combining portions protruded from the first top surface, each of the combining portions has a bottom end connected with the first bottom surface and a top end extended from the bottom end integrally, wherein the top end has a cross-sectional area bigger than that of the bottom end; and   a heat-dissipating body, having a second bottom surface and a second top surface, the second bottom surface having a pair of concave portions corresponding to a contour of the conductive base, and a plurality of combining grooves formed in the concave portion, wherein the shape of the combining grooves is corresponding to that of the combining portions, and the combining portions are correspondingly combined with the combining grooves.   
     
     
         2 . The compound heat-dissipating device according to  claim 1 , wherein the first bottom surface of the conductive base is flushed with the second bottom surface of the heat-dissipating body. 
     
     
         3 . The compound heat-dissipating device according to  claim 1 , wherein the second top surface of the heat-dissipating body has a plurality of heat-dissipating protrusions. 
     
     
         4 . The compound heat-dissipating device according to  claim 1 , wherein the combining portions of the conductive base are arranged in meshed manner. 
     
     
         5 . The compound heat-dissipating device according to  claim 4 , wherein the combining portions of the conductive base are arranged in rows manner along a longitudinal direction, wherein the odd rows of the combining portions in longitudinal direction are aligned to each other, and the even rows of the combining portions in longitudinal direction are aligned to each other. 
     
     
         6 . The compound heat-dissipating device according to  claim 1 , wherein each of the combining portions has peripheries shrank from the top end thereof toward the bottom end thereof. 
     
     
         7 . The compound heat-dissipating device according to  claim 6 , wherein the combining portions are trapezoid-shaped in cross-section, each top end of the combining portions is rectangular-shaped, and a pair of inclined surfaces are inwardly shrank from the top end gradually and connected to the first top surface of the conductive base. 
     
     
         8 . The compound heat-dissipating device according to  claim 1 , wherein the conductive base is a copper conductive base, and the heat-dissipating body is an aluminum heat-dissipating body. 
     
     
         9 . The compound heat-dissipating device according to  claim 1 , wherein the combining portions are T-shaped in cross-sectional view, each top end of the combining portions is rectangular-shaped, and has a level portion and a neck portion extended from the level portion to the first top surface of the conductive base.