Composition having alkaline ph and process for forming superconformation therewith

Abstract

A composition includes a solvent; a metal ion disposed in the solvent; an accelerator disposed in the solvent; and a suppressor disposed in the solvent, a pH of the composition being alkaline and effective to form a superconformation comprising a damascene deposit that includes an electrochemically reduced form of the metal ion. A process for forming a superconformation includes: contacting a substrate with a composition, the composition including: a solvent; a metal ion disposed in the solvent; an accelerator disposed in the solvent; and a suppressor disposed in the solvent; controlling a pH of the composition to be alkaline; and producing a damascene deposit on the substrate to form the superconformation, the damascene deposit including an electrochemically reduced form of the metal ion.

What is claimed is: 
     
         1 . A composition comprising:
 a solvent;   a metal ion disposed in the solvent;   an accelerator disposed in the solvent; and   a suppressor disposed in the solvent,   a pH of the composition being alkaline and effective to form a superconformation comprising a damascene deposit that comprises an electrochemically reduced form of the metal ion.   
     
     
         2 . The composition of  claim 1 , wherein the metal ion comprises a transition metal. 
     
     
         3 . The composition of  claim 2 , wherein the transition metal comprises copper, cobalt, manganese, silver, gold, or a combination comprising at least one of the foregoing transitions metals. 
     
     
         4 . The composition of  claim 1 , wherein the accelerator comprises an anion. 
     
     
         5 . The composition of  claim 4 , wherein the anion comprises sulfur, selenium, tellurium, oxygen, or a combination comprising at least one of the foregoing atoms. 
     
     
         6 . The composition of  claim 5 , wherein the anion comprises SeCN − . 
     
     
         7 . The composition of  claim 1 , wherein the suppressor comprises a polymer, a ligand, a halide, or a combination comprising at least one of the foregoing suppressors. 
     
     
         8 . The composition of  claim 7 , wherein the polymer comprises a functional group comprising a hydroxyl, sulfhydryl, carbonyl, amine, imine, amide, carboxyl, phosphate, sulfate, phenyl, halo, aldehyde, haloformyl, cyanate, nitrate, nitro, borono, or a combination comprising at least one of the foregoing functional groups. 
     
     
         9 . The composition of  claim 7 , wherein the ligand comprises a halide, an amide, an η 2 -alkene, CO, CS, CO2, CN, an amine, a nitrile, an isocyanide, a phosphane, an alkylidene, an alkyldiide, a nitrene, an imide, an oxide, an alkylidyne, an alkyltriide, an η 3 -allyl, an η 3 -enyl, an η 3 -cyclopropenyl, NO, an η 4 -diene, an θ 4 -cyclobutadiene, an η 5 -cyclopentadienyl, an η 6 -arene, an η 6 -triene, an Θ 7 -tropylium, an η 7 -cycloheptatrienyl, an η 8 -cyclooctatetraene, or a combination comprising at least one of the foregoing ligands. 
     
     
         10 . The composition of  claim 9 , wherein the ligand comprises a functional group that comprises hydrogen, alkyl, alkoxy, fluoroalkyl, cycloalkyl, heterocycloalkyl, cycloalkyloxy, aryl, aralkyl, aryloxy, aralkyloxy, heteroaryl, heteroaralkyl, alkenyl, alkynyl, NH 2 , amine, alkyleneamine, aryleneamine, alkenyleneamine, and hydroxyl. 
     
     
         11 . The composition of  claim 10 , wherein the ligand comprises an aminocarboxylic acid, a lactate, a malate, a citrate, or a combination comprising at least one of the foregoing. 
     
     
         12 . The composition of  claim 7 , wherein the halide comprises iodide, chloride, or a combination comprising lease one the foregoing halides. 
     
     
         13 . The composition of  claim 1 , wherein the pH is greater than or equal to 12. 
     
     
         14 . The composition of  claim 1 , wherein the metal ion is complexed to a ligand. 
     
     
         15 . A process for forming a composition, the process comprising:
 disposing a metal ion in a solvent;   disposing an accelerator in the solvent;   disposing a suppressor in the solvent; and   adjusting a pH of the composition to be alkaline and effective to form a superconformation comprising a damascene deposit that comprises an electrochemically reduced form of the metal ion.   
     
     
         16 . The process of  claim 15 , wherein the pH is greater than or equal to 12 after adjusting the pH. 
     
     
         17 . A process for forming a superconformation, the process comprising:
 contacting a substrate with a composition, the composition comprising:
 a solvent; 
 a metal ion disposed in the solvent; 
 an accelerator disposed in the solvent; and 
 a suppressor disposed in the solvent; 
   controlling a pH of the composition to be alkaline; and   producing a damascene deposit on the substrate to form the superconformation, the damascene deposit comprising an electrochemically reduced form of the metal ion.   
     
     
         18 . The process of  claim 17 , further comprising disposing an electrode in the composition. 
     
     
         19 . The process of  claim 18 , further comprising:
 subjecting the substrate to a first potential; and   subjecting the electrode to a second potential.   
     
     
         20 . The process of  claim 19 , further comprising controlling a potential difference between the first potential and the second potential. 
     
     
         21 . The process of  claim 19 , further comprising controlling a current between the substrate and the electrode. 
     
     
         22 . The process of  claim 19 , further comprising controlling a current density on the substrate. 
     
     
         23 . The process of  claim 19 , further comprising controlling a deposition rate of the electrochemically reduced form of the metal ion on the substrate. 
     
     
         24 . The process of  claim 19 , further comprising rotating the substrate relative to the composition at a rate of rotation. 
     
     
         25 . The process of  claim 24 , further comprising controlling the rate of rotation from 0 revolutions per minute (rpm) to 500 rpm. 
     
     
         26 . The process of  claim 19 , further comprising oscillating the substrate relative to the composition at a rate of oscillation. 
     
     
         27 . The process of  claim 26 , further comprising controlling the rate of oscillation from 0 millimeters per second (mps) to 50 mps. 
     
     
         28 . The process of  claim 27 , wherein oscillating comprises linearly oscillating the substrate relative to the composition. 
     
     
         29 . The process of  claim 17 , wherein the substrate comprises a trench. 
     
     
         30 . The process of  claim 29 , wherein the trench comprises a sub-micrometer width. 
     
     
         31 . The process of  claim 17 , wherein the metal ion is complexed to a ligand in the composition.