Sealed pixel assemblies, kits and methods

Abstract

Discrete flexible pixel assemblies can be hermetically sealed from the environment and can comprise unitary, self-contained replaceable modules which enable efficient, economical production of large scale, free-form electronic displays, signs and lighting effects for outdoor use. The method and means for producing hermetically sealed discrete flexible pixel assemblies can include encapsulation means, exterior encasement means, and cable connector means.

1 - 20 . (canceled) 
     
     
         21 . A sealed module comprising:
 a circuit board including one or more light-emitting elements coupled to a first surface of the circuit board; and   an encapsulating material encapsulating and sealing at least a portion of the first surface of the circuit board from an environment exterior.   
     
     
         22 . The sealed module of  claim 21 , further comprising a potting shell coupled to the circuit board, the potting shell including at least one cavity at least partially enclosing the one or more light-emitting elements, wherein the encapsulating material is disposed within the at least one cavity. 
     
     
         23 . The sealed module of  claim 22 , further comprising an encasement cover having an internal cavity configured to receive at least a portion of the potting shell, the circuit board, the one or more light emitting elements, and the encapsulating material. 
     
     
         24 . The sealed module of  claim 22 , wherein the at least one cavity is a first cavity and wherein the potting shell includes a second cavity extending from the circuit board in an opposed direction to the first cavity, the sealed module further comprising second encapsulating material disposed within the second cavity. 
     
     
         25 . The sealed module of  claim 21 , wherein the portion of the first surface of the circuit board being encapsulated and sealed includes a portion surrounding each of the light-emitting elements. 
     
     
         26 . The sealed module of  claim 21 , wherein the encapsulating material encapsulates and seals at least a portion of each of the light-emitting elements from the environment exterior. 
     
     
         27 . The sealed module of  claim 21 , wherein the encapsulating material comprises at least one of a ductile foam, a malleable solid potting material, a potting resin configured harden on exposure to the atmosphere, heat, or a reactive agent, and a potting gel configured to harden on exposure to the atmosphere, heat, or a reactive agent, a potting resin and a potting gel that is configured to harden on exposure to the atmosphere, heat, or a reactive agent. 
     
     
         28 . The sealed module of  claim 21 , wherein the encapsulating material hermetically seals at least the first surface of the circuit board from the environment exterior. 
     
     
         29 . The sealed module of  claim 21 , wherein the potting shell is coupled to a perimeter of the circuit board. 
     
     
         30 . The sealed module of  claim 21 , comprising one or more connectors coupled to the circuit board, the one or more connectors configured for input to the circuit board or output from the circuit board, or both. 
     
     
         31 . The sealed pixel module of  claim 30 , wherein each of the one or more connectors are configured for coupling with at least one other sealed module to provide an electronic display device. 
     
     
         32 . The sealed pixel module of  claim 30 , wherein the encapsulating material encapsulates and seals at least a portion of the one or more connectors. 
     
     
         33 . The sealed pixel module of  claim 30 , wherein the one or more connectors comprise one or more cables. 
     
     
         34 . The sealed module of  claim 21 , wherein the encapsulating material encapsulates and seals the portion of the circuit board and at least a portion of each of the one or more lighting elements from at least one of moisture, humidity, solar radiation, atmospheric pressure changes, vacuum, corrosive chemicals, electrical shock, thermal shock, and mechanical shock. 
     
     
         35 . A method comprising:
 providing or receiving a plurality of first sealed modules, wherein each first sealed module includes a first circuit board, one or more first light emitting elements coupled to the first circuit board, a first encapsulation material covering and sealing at least a portion of the first circuit board from an environment exterior, one or more first input connectors electrically coupled to the first circuit board, and one or more first output connectors electrically coupled to the first circuit board; and   connecting the plurality of first sealed modules to form a first flexible pixel string by serially electrically coupling the first input and the first output connectors of adjacent first sealed modules.   
     
     
         36 . The method of  claim 35 , further comprising:
 providing or receiving a plurality of second sealed modules, wherein each second sealed module includes a second circuit board, one or more second light emitting elements coupled to the second circuit board, a second encapsulation material covering and sealing at least a portion of the second circuit board from the environment exterior, one or more second input connectors electrically coupled to the second circuit board, and one or more second output connectors electrically coupled to the second circuit board;   connecting the plurality of second sealed modules to form a second flexible pixel string by serially electrically coupling the second input connectors and the second output connectors of adjacent second sealed modules; and   combining at least the first flexible pixel string and the second flexible pixel string to form an electronic display.   
     
     
         37 . The method of  claim 35 , further comprising coupling one or more of the plurality of the first sealed modules of the first flexible pixel string to a mounting surface. 
     
     
         38 . The method of  claim 35 , wherein the encapsulating material of each of the plurality of first sealed modules encapsulates and seals at least a portion of each of the first light-emitting elements from the environment exterior. 
     
     
         39 . The method of  claim 35 , wherein the encapsulating material of each of the plurality of first sealed modules protects against at least one of moisture and humidity. 
     
     
         40 . The method of  claim 39 , wherein the encapsulating material of each of the plurality of first sealed modules further protects against at least one of solar radiation, atmospheric pressure change, vacuum, corrosive chemicals, electrostatic shock, thermal shock, and mechanical shock.