Thin Gage Open Loop System Cards and Method of Manufacture

Abstract

An improved card design and manufacturing method to produce thin gage, open loop system cards, such as credit cards, debit cards, prepaid cards, financial cards, and payroll cards. The thin gage card structure may vary between 5-15 mils in thickness (0.005″ inches to 0.015″ inches) on a one ply plastic material such as PVC or polyester. The majority of manufacturing steps can be performed on a rotary press in a single operation. Card personalization will be accomplished on a high-speed machine using ink jet for all variable information imaged on both the front and back, and accompanied by high speed encoding of magnetic stripe or activation of integrated circuit elements utilized in the electronic payment process.

1 . A thin gage open loop system card, comprising:
 a) a generally rectangular card body, further comprising a thin gage one ply plastic material between 5 and 15 mil thickness;   b) a front side and back side of the card having at least graphics printed thereupon.   
     
     
         2 . The card in  claim 1 , wherein the thickness of the card would preferably be in the range of 7 to 10 mil thickness. 
     
     
         3 . The card in  claim 1 , wherein there would further be provided a hologram on the front or back side of the card. 
     
     
         4 . The card in  claim 1 , wherein a magnetic stripe is applied to the back side of the plastic thin gage material by the preferred method of first, applying a magnetic slurry stripe directly to the plastic. 
     
     
         5 . The card in  claim 1 , wherein a magnetic stripe is applied to the back side of the plastic thin gage material by applying a hot stamped magnetic tape. 
     
     
         6 . The card in  claim 1 , wherein the hologram would be applied in a rotary press operation by printing front and back sides of cards and then applying the hologram or applying the hologram to single cards after die cutting. 
     
     
         7 . The card in  claim 1 , wherein a signature panel comprised of an ink receptive coating, label, or hot stamp transfer coating is applied to the back of the card. 
     
     
         8 . The card in  claim 1 , wherein an integrated circuit is applied to the card. The integrated circuit may function either by direct contact with a terminal or by radio frequency communications with a host terminal. 
     
     
         9 . A process for manufacturing a thin gage open loop system card, comprising the following steps:
 a) providing a thin gage one ply plastic type material, not to exceed 15 mil thickness, having front and back sides;   b) applying a magnetic stripe, as required, to the back side of the thin gage material by applying a magnetic stripe directly to the material;   c) utilizing a rotary press operation to print the front and back sides of cards and apply a hologram thereto;   d) printing the signature panel, as required, onto the back side of the card using specialty inks;   e) personalizing the card by using high-speed ink jet application on the front and back sides to provide variable information and magnetic encoding.   
     
     
         10 . The process in  claim 7 , wherein there may be multi-part snap apart cards, scored along a common edge, to be disengaged from one another so that one card may be used to carry out a transaction and the second card be used for informational and advertising purposes. 
     
     
         11 . A process for manufacturing a thin gage open loop system multi-part snap apart cards, comprising the following steps:
 a) providing the first card with a thin gage one ply plastic material, not to exceed  15  mil thickness, having front and back sides;   b) applying a magnetic stripe to the back side of the first card of thin gage material by applying a magnetic stripe directly to the material;   c) utilizing a rotary press operation to print the front and back sides of the first card and applying a hologram thereto;   d) printing the signature panel, as required, onto the back side of the first card using specialty inks or hot stamp transfer;   e) personalizing the first card by using high-speed ink jet application on the front and back sides to provide variable information and magnetic encoding; and   f) scoring along a common edge of the two cards, so that the cards can be disengaged from one another so that the first card may be used to carry out a transaction and the second card be used for informational and advertising purposes.   
     
     
         12 . A process for manufacturing a thin gage open loop system card, of the type comprising a generally rectangular card body, further comprising a thin gage one ply plastic material between 5 and 15 mil thickness; a front side of the card having at least graphics printed thereupon; and a back side of the card potentially having a signature panel and either a magnetic stripe or integrated circuit for reading the cards contents; the process comprising the following steps:
 a) providing the thin gage one ply plastic material, not to exceed 15 mil thickness, having front and back sides;   b) applying a magnetic stripe to the back side of the thin gage material by applying a magnetic stripe directly to the material;   c) utilizing a rotary press operation to print the front and back sides of cards and apply a hologram thereto;   d) printing the signature panel, as required, onto the back side of the card using specialty inks or hot stamp transfer;   e) personalizing the card by using high-speed ink jet application on the front and back sides to provide variable information and magnetic encoding.