Optoelectronic package and method for making same

Abstract

An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.

What is claimed is: 
     
         1 . A method for making an optoelectronic package, the method comprising:
 applying a first adhesive to a first adhesive bonding area of a cover element;   placing the cover element onto a substrate so that the first adhesive bonding area of the cover element is in direct contact with a predetermined region of the substrate;   curing the first adhesive so as to secure the cover element onto the substrate;   applying a second adhesive to a second adhesive bonding area defined between the cover element and the substrate; and   curing the second adhesive; wherein:   the second adhesive bonding area is defined through the engagement of the cover element and the substrate, and configured to allow the second adhesive to be in direct contact with both the cover element and the substrate, and confined within a localized area.   
     
     
         2 . The method of  claim 1  further comprising assembling semiconductor chips and optoelectronic components onto the substrate before applying the first adhesive to the first adhesive bonding area. 
     
     
         3 . The method of  claim 1  further comprising employing a precision placement process to align functional features on the cover element with the optoelectronic components. 
     
     
         4 . The method of  claim 1 , wherein the second adhesive is cured by a longer curing process than the first adhesive. 
     
     
         5 . The method of  claim 4 , wherein the first adhesive is cured by ultra-violet light. 
     
     
         6 . The method of  claim 4 , wherein the second adhesive is cured by thermal curing. 
     
     
         7 . The method of  claim 1 , wherein two through slots are formed at two opposite sides of the substrate respectively, the engagement of the two through slots and the cover element defining the second adhesive bonding area. 
     
     
         8 . The method of  claim 7 , wherein an additional step is formed inside each of the through slots and configured for increasing the area of the substrate within the through slots that contacts the second adhesive. 
     
     
         9 . The method of  claim 7 , wherein two openings are formed at two opposite sides of the cover element respectively, the engagement of the two through slots and the two openings defining the second adhesive bonding area. 
     
     
         10 . The method of  claim 9 , wherein the two through slots and the two openings are aligned forming two through cavities respectively, the through cavities being configured for receiving the second adhesive and providing paths for air to escape when the second adhesive is applied.