Heating device for hot stamping

Abstract

A heating device for hot stamping is configured to heat a plated metallic material while conveying the plated metallic material. The heating device for hot stamping comprises: a first heating tank provided in a conveyance path for the plated metallic material; and a second heating tank provided downstream of the first heating tank in the conveyance path. A heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and a heating amount provided by the first heating tank is configured to be larger than the heating amount provide by the second heating tank.

1 . A heating device for hot stamping configured to heat a plated metallic material while conveying the plated metallic material, the heating device for hot stamping comprising:
 a first heating tank provided in a conveyance path for the plated metallic material; and   a second heating tank provided downstream of the first heating tank in the conveyance path,   wherein a heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and   wherein a heating amount provided by the first heating tank is configured to be larger than the heating amount provided by the second heating tank.   
     
     
         2 . The heating device for hot stamping according to  claim 1 ,
 wherein the first heating tank is designed such that a staying time of the plated metallic material is longer in the first heating tank than in the second heating tank.   
     
     
         3 . The heating device for hot stamping according to  claim 1 ,
 wherein the first heating tank and the second heating tank are formed in a continuous space and use an infrared heater as a heat source.   
     
     
         4 . The heating device for hot stamping according to  claim 3 ,
 wherein a temperature of the infrared heater is configured to be higher in the first heating tank than in the second heating tank.   
     
     
         5 . The heating device for hot stamping according to  claim 2 ,
 wherein the conveyance path is longer through the first heating tank than through the second heating tank.