Device for metalizing substrates

Abstract

A wet-chemical treatment system for electrochemically coating flat substrates with coating material, has having a basin for receiving an electrolyte, a transporting means, by means of which the flat substrates can be transported through the electrolyte horizontally, and at least one contact element which comprises a shaft having an axis of rotation and a cylindrical circumferential surface suitable for rolling on the substrate, wherein the circumferential surface comprises at least one electrically insulated segment and at least one electrically conductive segment which can be connected to a current source in such a way that the polarity can be reversed, wherein the axis of rotation of the contact element is positioned above the surface of the electrolyte, and wherein the contact element is designed as a consumable electrode.

1 . A wet-chemical treatment system for electrochemically coating flat substrates ( 1 ) with coating material, with a basin for receiving an electrolyte, a transporting means, by means of which the flat substrate ( 1 ) can be transported horizontally through the electrolyte, and with at least one contact element ( 2 ) which comprises a shaft ( 4 ) having an axis of rotation ( 5 ) and a cylindrical circumferential surface suitable for rolling on the substrate ( 1 ), wherein the circumferential surface comprises at least one electrically insolated segment ( 3 B) and at least one electrically conductive segment ( 3 A) which can be connected to a current source ( 6 ) in such a way that the polarity can be reversed, wherein the axis of rotation ( 5 ) of the contact element ( 2 ) is positioned above the surface of the electrolyte, and wherein the contact element ( 2 ) is designed as a consumable electrode. 
     
     
         2 . The treatment system according to  claim 1 , wherein the contact element ( 2 ) is designed as a pipe or rod of coating material and has an electrically insolating layer along at least one longitudinal section of its circumferential surface destined for contacting the substrate ( 1 ). 
     
     
         3 . The treatment system according to  claim 2 , wherein the insolating layer is designed as a plastic piece which can be mounted on the circumferential surface. 
     
     
         4 . The treatment system according to  claim 1 , wherein the shaft ( 4 ) of the contact element ( 2 ) at a longitudinal or end section ( 8 ) not being destined for contacting the substrate ( 1 ) has a wiper contact surface ( 9 ) for its commutatable connection to the current source ( 6 ). 
     
     
         5 . The treatment system according to  claim 4 , wherein the wiper contact surface ( 9 ) is positioned completely outside of the electrolyte. 
     
     
         6 . The treatment system according to  claim 1 , wherein the contact element ( 2 ) is a holding-down means to avoid the substrates ( 1 ) to float. 
     
     
         7 . The treatment system according to  claim 1 , wherein the contact element ( 2 ) is a cylindrical transporting means. 
     
     
         8 . The treatment system according to  claim 1 , wherein flush nozzles are positioned within the electrolyte for the continuous flow of the electrolyte against those parts of the contact element ( 2 ) which are also positioned within the electrolyte. 
     
     
         9 . The treatment system according to  claim 1 , wherein flush nozzles are positioned outside the electrolyte for the continuous wetting of those parts of the contact element ( 2 ) with the electrolyte which are also positioned outside the electrolyte.