Mounting structure and method for dissipating heat from a computer expansion card

Abstract

A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.

1 . A mounting structure configured for mounting an expansion card within a computer enclosure and for absorbing and conducting heat from a heat source on the expansion card to an ambient atmosphere surrounding the enclosure, the mounting structure comprising:
 a mounting bracket configured to support the expansion card within the computer enclosure;   means for securing the mounting bracket to the enclosure;   a heat sink adapted to contact a surface of the heat source on the expansion card;   an extension interconnecting the heat sink and the mounting bracket;   means for conducting heat from the heat sink to the mounting bracket; and   means associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding an exterior of the enclosure by a phase change medium within the mounting structure.   
     
     
         2 . The mounting structure of  claim 1 , wherein the extension defines the conducting means. 
     
     
         3 . The mounting structure of  claim 1 , wherein the mounting structure is an assembled structure in which the heat sink is assembled with the extension and the mounting bracket. 
     
     
         4 . The mounting structure of  claim 1 , wherein the heat sink is received within a frame defined by the extension. 
     
     
         5 . The mounting structure of  claim 4 , further comprising means for biasing the heat sink away from the frame. 
     
     
         6 . The mounting structure of  claim 1 , wherein the heat sink, the extension, and the mounting bracket define a vapor chamber that contains a phase change medium, and the conducting means comprises the vapor chamber and the phase change medium therein. 
     
     
         9 . The mounting structure of  claim 1 , wherein the heat sink and the extension are oriented so as to be substantially parallel to the expansion card when the expansion card is mounted to the mounting structure. 
     
     
         10 . In a computer system having an enclosure for mounting an expansion card therein, the computer system comprising a mounting structure mounting the expansion card within the enclosure, the mounting structure comprising:
 a mounting bracket secured to the enclosure and configured to support the expansion card within the enclosure;   a heat sink contacting a surface of an integrated circuit chip on the expansion card;   an extension interconnecting the heat sink and the mounting bracket;   means for conducting heat from the heat sink to the mounting bracket; and   means associated with the mounting bracket for dissipating heat from the mounting structure directly to the ambient atmosphere surrounding an exterior of the enclosure by a phase change medium within the mounting structure.   
     
     
         11 . The computer system of  claim 10 , wherein the extension defines the conducting means. 
     
     
         12 . The computer system of  claim 10 , wherein the mounting structure is an assembled structure in which the heat sink is assembled with the extension and the mounting bracket. 
     
     
         13 . The computer system of  claim 12 , wherein the heat sink is received within a frame defined by the extension. 
     
     
         14 . The computer system of  claim 13 , further comprising mean for biasing the heat sink away from the frame. 
     
     
         15 . The computer system of  claim 10 , wherein the heat sink, the extension, and the mounting bracket define a vapor chamber that contains a phase change medium, and the conducting means comprises the vapor chamber and the phase change medium therein. 
     
     
         16 . A method of mounting an expansion card within a computer enclosure and for absorbing and conducting heat from a heat source on the expansion card to an ambient atmosphere surrounding the enclosure, the method comprising:
 securing the expansion card to the mounting bracket so that a heat sink extending from the mounting bracket contacts a surface of the heat source;   securing the mounting bracket to the enclosure, the mounting bracket supporting the expansion card within the computer enclosure;   conducting heat from the heat sink to the mounting bracket; and   dissipating heat from the mounting structure to the ambient atmosphere surrounding an exterior of the enclosure by a phase change medium within the mounting structure.   
     
     
         17 . The method of  claim 16 , wherein the extension defines the conducting means. 
     
     
         18 . The method of  claim 16 , wherein the mounting structure is an assembled structure in which the heat sink is assembled with the extension and the mounting bracket. 
     
     
         19 . The method of  claim 16 , wherein the heat sink is received within a frame defined by the extension, the method further comprising biasing the heat sink away from the frame. 
     
     
         20 . The method of  claim 16 , wherein the heat sink, the extension, and the mounting bracket define a vapor chamber that contains a phase change medium, and conducting heat from the heat sink to the mounting bracket is performed with the vapor chamber and the phase change medium therein.