System and method for the sonic-assisted cleaning of substrates utilizing a sonic-treated liquid

Abstract

The present invention is directed to sonic-assisted systems mid methods of processing of substrates utilizing a sonic-treated liquid. In one embodiment, the sonic-treated liquid can be created by subjecting a desired processing liquid to sonic energy generated by a first sonic energy source prior to being applied So the substrate, The sonic-treated liquid is applied to the substrate where a second source of sonic energy applies sonic energy to the substrate. The sonic-treated liquid can be used as the coupling fluid between the second source of sonic energy and the substrate.

What is claimed is: 
     
         1 . A system for processing substrates comprising:
 a support for supporting a substrate;   a vibration transmitter positioned close to and spaced from a surface of a substrate on the support;   a dispenser for providing a liquid between a portion of the vibration transmitter and a surface of a substrate on the support;   a first source of sonic energy for applying sonic energy to the liquid prior to the liquid being provided between the vibration transmitter and the surface of the substrate; and   a second source of sonic energy operably coupled to the vibration transmitter.   
     
     
         2 . The system of  claim 1  wherein the support is a rotatable support. 
     
     
         3 . The system of  claim 1  further comprising:
 a source of the liquid; 
 a supply line fluidly coupling the liquid source to the dispenser; and 
 wherein the first source of sonic energy is operably coupled to the supply line at a location between the liquid source and the dispenser. 
 
     
     
         4 . The system of  claim 1  wherein the first source of sonic energy applies sonic energy to the liquid so as to cause cavitations within the liquid. 
     
     
         5 . The system of  claim 1  wherein the first source of sonic energy applies sonic energy to the liquid in a manner that achieves a desired bubble size within the liquid. 
     
     
         6 . The system of  claim 1  wherein the first source of sonic energy comprises one or more transducers adapted to operate at a first frequency and a first power and the second source of sonic energy comprises one or more transducers adapted to operate a second power and a second frequency. 
     
     
         7 . The system of  claim 1  further comprising:
 a supply line fluidly coupled to the dispenser; and 
 wherein the first source of sonic energy comprises one or more transducers acoustically coupled to the supply line. 
 
     
     
         8 . The system of  claim 1  wherein the dispenser provides the liquid so as to form a layer of the liquid on a surface of a substrate on the support, the transmitter being in contact with the layer of the liquid. 
     
     
         9 . The system of  claim 1  wherein the transmitter is selected from the group consisting of a pie-shaped transmitter, a rod-like transmitter, a plate transmitter, and a lens transmitter. 
     
     
         10 . The system of  claim 1  wherein the transmitter is constructed of quartz, sapphire, boron-nitride or vitreous carbon. 
     
     
         11 . The system of  claim 1  further comprising a first dispenser adapted to apply a layer of fluid on a surface of a substrate on the support, the transmitter being in contact with the layer of the fluid. 
     
     
         12 . The system of  claim 11 , wherein the liquid dispenser provides the liquid at or near the vibration transmitter and the surface of the substrate. 
     
     
         13 . The system of  claim 1 , wherein the portion of the vibration transmitter is an elongated edge portion. 
     
     
         14 . A system for processing substrates comprising:
 a support for supporting a substrate;   a first sonic energy source for applying sonic energy to a liquid, thereby creating a sonic-treated liquid;   a second source of sonic energy positioned close to and spaced from a surface of a substrate on the support; and   means for applying the sonic-treated liquid to a surface of a substrate on the support.   
     
     
         15 . The system of  claim 1  wherein the second sonic energy source operates at a different power and/or frequency than the first sonic energy source. 
     
     
         16 . A system for processing substrates comprising:
 a rotatable support for supporting and rotating a substrate;   a vibration transmitter positioned so that at least a portion of the transmitter is adjacent to a surface of a substrate on the support;   a first dispenser for applying a liquid to the surface of the substrate on the support so as to form a film of liquid on the surface of the substrate that couples the portion of the transmitter to the surface of the substrate;   a first source of sonic energy for applying sonic energy to the liquid prior to the liquid being applied to the surface of the substrate; and   a second source of sonic energy operably coupled to the vibration transmitter.   
     
     
         17 . The system of  claim 16  further comprising:
 a source of the liquid; 
 a supply line fluidly coupling the liquid source to the first dispenser; and 
 wherein the first source of sonic energy is operably coupled to the supply line at a location between the liquid source and the first dispenser. 
 
     
     
         18 . The system of  claim 16  wherein the first source of sonic energy is adapted to apply sonic energy at a power and frequency that cavitates the liquid. 
     
     
         19 . The system of  claim 16  wherein the first source of sonic energy comprises one or more transducers adapted to operate at a first frequency and a first power and the second source of sonic energy comprises one or more transducers adapted to operate at a second power and a second frequency. 
     
     
         20 . The system of  claim 19  wherein the first power and/or frequency is different from the second power and/or frequency.