Heat spreading layer with high thermal conductivity

Abstract

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

What is claimed is: 
     
         1 . A cooling system for a semiconductor package comprising:
 a heat spreading layer partially encased in a supporting frame, the heat spreading layer including a perimeter, the supporting frame being configured to encase the perimeter and an adjacent portion of the heat spreading layer, defining centrally exposed top and bottom portions of the heat spreading layer; and   a heat generating element thermally connected to the centrally exposed bottom portion of the heat spreading layer.   
     
     
         2 - 9 . (canceled) 
     
     
         10 . The system of  claim 1 , wherein the supporting frame comprises at least a first piece and a second piece. 
     
     
         11 . The system of  claim 10 , wherein the first piece and the second piece of the supporting frame are joined mechanically, by an adhesive material, and/or by a thermally conductive adhesive material. 
     
     
         12 - 25 . (canceled)