Systems and methods for implementing digital vapor phase patterning using variable data digital lithographic printing techniques

Abstract

A system and method are provided for implementing a unique scheme by which to execute digital vapor phase patterning on metals, semiconductor substrates and other surfaces using a proposed variable data digital lithographic image forming architecture or technique. For certain substrate printing and manufacturing applications, including some printed electronics applications, the disclosed schemes implement techniques to digitally pattern metal layers with bulk material properties in a manner that is aligned with underlying layers on the fly. The disclosed digital printing process may pattern a release oil on a substrate in support of a metal deposition process. Changeable patterning is implemented with an ability to modify the alignment of the patterns on-the-fly. The release layer on a drum is laser patterned in order that the patterned release layer is transferred to the substrate, or the patterning of the release layer is accomplished directly on the substrate.

We claim: 
     
         1 . A material deposition system, comprising:
 a release agent applying device for applying a layer of release agent on one of a substrate or an intermediate surface;   a patterning device for patterning the layer of release agent on the one of the substrate or the intermediate surface according to an imaging input;   a deposition device for depositing a pattern substance on a surface of the substrate and patterned layer of release agent, the pattern substance adhering to portions of the substrate not covered by the release agent; and   a cleaner device for removing residual pattern substance and the release agent from the surface of the substrate.   
     
     
         2 . The material deposition system of  claim 1 , the intermediate surface being a reimageable surface on an imaging member, the layer of a release agent, once patterned, being transferred to the substrate at a transfer nip between the reimageable surface and the substrate. 
     
     
         3 . The material deposition system of  claim 1 , at least the release agent applying device, the patterning device and the deposition device being located in a vacuum chamber. 
     
     
         4 . The material deposition system of  claim 1 , further comprising a processing device for directing the patterning of the layer of release agent based on the imaging input. 
     
     
         5 . The material deposition system of  claim 4 , further comprising an imaging device positioned upstream of the patterning device that images at least one of alignment marks on the substrate or an underlying pattern already disposed on the substrate. 
     
     
         6 . The material deposition system of  claim 5 , the imaging device sending a signal to the processing device to modify the directed patterning of the layer of release agent based on the imaged at least one of alignment marks on the substrate or the underlying pattern already disposed on the substrate. 
     
     
         7 . The material deposition system of  claim 4 , the imaging input in the processing device being changed between each directed patterning of the release agent. 
     
     
         8 . The material deposition system of  claim 1 , further comprising at least one heating component to evaporate the patterned layer of release agent on the surface of the substrate to remove residual release agent and non-patterned residual pattern substance from the surface of the substrate. 
     
     
         9 . The material deposition system of  claim 1 , the release agent applying device applying the layer of release agent via at least one of a contact roller process, a spray process, or an ink jetting process. 
     
     
         10 . The material deposition system of  claim 1 , the patterning device being a laser device for selectively patterning the layer of release agent on the one of the substrate or the intermediate surface. 
     
     
         11 . The material deposition system of  claim 1 , the deposition device being a vapor deposition device. 
     
     
         12 . A material deposition method, comprising:
 applying a layer of release agent on one of a substrate or an intermediate surface;   patterning the layer of release agent on the one of the substrate or the intermediate surface based on inputs an imaging input from a processor;   depositing a pattern substance on a surface of the substrate and the patterned layer of release agent, the pattern substance adhering to portions of the substrate not covered by the release agent;   removing residual pattern substance and the release agent from the surface of the substrate; and   outputting manufactured components comprising the deposited pattern substance on the surface of the substrate.   
     
     
         13 . The material deposition method of  claim 12 , the intermediate surface being a reimageable surface on an imaging member, the method further comprising transferring the patterned layer of the release agent to the substrate at a transfer nip between the reimageable surface and the substrate. 
     
     
         14 . The material deposition method of  claim 12 , at least the release agent applying device, the patterning device and the deposition device being located in a vacuum chamber. 
     
     
         15 . The material deposition method of  claim 12 , further comprising imaging at least one of alignment marks on the substrate or an underlying pattern already disposed on the substrate with an imaging device positioned upstream of the patterning device in a process direction. 
     
     
         16 . The material deposition method of  claim 15 , the imaging device sending a signal to the processor for modifying the directed patterning of the layer of release agent based on the imaged at least one of alignment marks on the substrate or the underlying pattern already disposed on the substrate. 
     
     
         17 . The material deposition method of  claim 12 , the patterning of the layer of release agent on the one of the substrate or the intermediate surface being based on inputs from the processor that change between each directed patterning of the release agent. 
     
     
         18 . The material deposition method of  claim 12 , further comprising heating the substrate after the pattern substance is deposited on the surface of the substrate to evaporate the patterned layer of release agent on the surface of the substrate to remove residual release agent and non-patterned residual pattern substance from the surface of the substrate. 
     
     
         19 . The material deposition method of  claim 12 , the release agent being applied via at least one of a contact roller process, a spray process, or an inkjet process. 
     
     
         20 . The material deposition method of  claim 12 , the patterning comprising employing a laser device for selectively patterning the layer of release agent on the one of the substrate or the intermediate surface. 
     
     
         21 . The material deposition method of  claim 12 , the depositing the pattern substance being according to a vapor deposition process. 
     
     
         22 . A non-transitory data storage medium on which is stored instructions that, when executed by a processor, cause the processor to execute the steps of a material deposition method, comprising:
 applying a layer of release agent on one of a substrate or an intermediate surface;   patterning the layer of release agent on the one of the substrate or the intermediate surface based on imaging inputs;   depositing a pattern substance on a surface of the substrate and the patterned layer of release agent, the pattern substance adhering to portions of the substrate not covered by the release agent;   removing residual pattern substance and the release agent from the surface of the substrate; and   outputting manufactured components comprising the deposited pattern substance on the surface of the substrate.