Pressure Sensor System

Abstract

A pressure sensor system having a pressure sensor chip is specified, which is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.

1 - 15 . (canceled) 
     
     
         16 . A pressure sensor system comprising:
 a pressure sensor chip mounted on a mounting receptacle of a housing body comprising a ceramic material, the housing body having a pressure feed guided to the pressure sensor chip;   wherein the housing body comprises a non-planar three-dimensional surface topography on a mounting side on which the sensor chip is mounted,   wherein the housing body is a monolithic structure, and   wherein a coefficient of thermal expansion of the housing body deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.   
     
     
         17 . The pressure sensor system according to  claim 16 , wherein the pressure sensor chip is based on silicon. 
     
     
         18 . The pressure sensor system according to  claim 16 , wherein the ceramic material comprises mullite. 
     
     
         19 . The pressure sensor system according to  claim 16 , wherein the ceramic material comprises aluminum oxide, zirconium oxide, aluminum nitride, silicon carbide, and/or silicon nitride. 
     
     
         20 . The pressure sensor system according to  claim 16 , the ceramic material consists of one or more selected from mullite, aluminum nitride, silicon carbide, and/or silicon nitride. 
     
     
         21 . The pressure sensor system according to  claim 16 , wherein the coefficients of thermal expansion of the housing body and the pressure sensor chip deviate by less than 10% from one another in a temperature range of greater than or equal to −50° C. and less than or equal to 200° C. 
     
     
         22 . The pressure sensor system according to  claim 16 , wherein the mounting receptacle is formed by a protrusion or a depression of the housing body and the pressure feed opens into the mounting receptacle. 
     
     
         23 . The pressure sensor system according to  claim 16 , wherein the housing body comprises a pressure fitting and the pressure feed extends from the pressure fitting up to the pressure sensor chip. 
     
     
         24 . The pressure sensor system according to  claim 16 , wherein a signal processing chip is mounted on a further mounting receptacle of the housing body. 
     
     
         25 . The pressure sensor system according to  claim 16 , wherein the pressure sensor chip is mounted by a rigid connecting material directly on the mounting receptacle formed by a glass solder, a metallic solder, or an epoxy resin adhesive. 
     
     
         26 . The pressure sensor system according to  claim 16 , wherein the housing body is three-dimensionally shaped and monolithically formed by a ceramic injection molding method. 
     
     
         27 . The pressure sensor system according to  claim 16 , wherein the pressure sensor system comprises electrical connections on the housing body for the electrical connection of at least the pressure sensor chip, which comprise one or more of the following elements: wiring carrier, conductor tracks, and bond wires. 
     
     
         28 . The pressure sensor system according to  claim 16 , wherein the pressure sensor chip is electrically contacted by bond wire connections covered with a polymer potting. 
     
     
         29 . The pressure sensor system according to  claim 16 , wherein the pressure sensor system comprises a cover fastened on the housing body above the pressure sensor chip. 
     
     
         30 . The pressure sensor system according to  claim 29 , wherein the cover is fastened on the housing body by a mechanical lock. 
     
     
         31 . A method of forming a pressure sensor system, the method comprising:
 providing a pressure sensor chip;   using a ceramic injection molding method or by an HTCC multi-layer method, forming a housing body having a monolithical structure and comprising a non-planar three-dimensional surface topography on a mounting side; and   mounting the pressure sensor chip over the mounting side of the housing body, wherein the coefficient of thermal expansion of the housing body deviates from the coefficient of thermal expansion of the sensor chip by less than 30% in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.   
     
     
         32 . The method of  claim 31 , wherein the housing body comprises mullite. 
     
     
         33 . The method of  claim 31 , wherein forming the housing body comprises sintering at 1500° C. to 1750° C. in air. 
     
     
         34 . The method of  claim 31 , wherein forming the housing body comprises fixing a cover on the housing body above the sensor chip. 
     
     
         35 . The method of  claim 34 , wherein the cover is fastened on the housing by a mechanical lock.