Method for manufacturing semiconductor package

Abstract

Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.

1 . A method for manufacturing a package, comprising:
 preparing a frame having holes;   disposing an element in a hole of the frame;   forming a molding part to cover the element;   forming a redistribution layer (RDL) on one side of the frame and the element.   
     
     
         2 - 5 . (canceled) 
     
     
         6 . The method of  claim 1 , wherein a thickness of the frame is greater than a thickness of the element. 
     
     
         7 . The method of  claim 1 , wherein the molding part is an epoxy molding compound (EMC). 
     
     
         8 . (canceled) 
     
     
         9 . The method of  claim 1 , wherein the frame and the molding part have different colors. 
     
     
         10 . The method  claim 1 , wherein the forming of the RDL comprises:
 forming an insulating layer;   forming a via hole in the insulating layer; and   forming the wiring by plating and filling the via hole.   
     
     
         11 . The method of  claim 10 , further comprising:
 after the forming of the wiring, forming a connecting terminal, which is an external connection terminal part, on the wiring.   
     
     
         12 . (canceled) 
     
     
         13 . The method of  claim 1 , wherein the disposing the element in the hole of the frame comprises:
 attaching a portion of adhesive tape to one surface of the frame; and   attaching the element to a portion of the adhesive tape exposed by the hole of the frame.   
     
     
         14 . The method of  claim 13 , further comprising:
 after the forming of the molding part, peeling the tape.   
     
     
         15 . A method for manufacturing a package, comprising:
 preparing a frame having a plurality of holes;   disposing a plurality of elements in the holes of the frame, respectively;   forming a molding part to cover the elements;   forming a redistribution layer (RDL) on one side of the frame and the elements; and   singulating the package as a plurality of individual unit packages.   
     
     
         16 . The method of  claim 15 , wherein after the singulating of the package, at least a portion of the frame remains on side surfaces of the individual unit packages. 
     
     
         17 . The method of  claim 15 , wherein after the singulating of the package, the frame is removed in the individual unit packages.