Integrated circuit controlled ejection system (icces) for massively parallel integrated circuit assembly (mpica)

Abstract

Methods, systems, and apparatuses are described for integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) printing to achieve very high resolution manufacturing to meet the precision tolerances required for very small IC die sizes.

What is claimed is: 
     
         1 . A method of operation for an integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA) performed in accordance with any of the embodiments described or shown herein. 
     
     
         2 . The method of  claim 1 , further comprising:
 providing at least one die retention cubby, in a die retention layer, in which at least one corresponding die resides until ejected onto an adjacent substrate.   
     
     
         3 . The method of  claim 2 , wherein the at least one die retention cubby performs a function in accordance with any of the embodiments described or shown herein. 
     
     
         4 . The method of  claim 1 , further comprising:
 providing at least one push piston, in a push piston layer, to eject at least one corresponding die into a substrate.   
     
     
         5 . The method of  claim 4 , wherein the at least one push piston performs a function in accordance with any of the embodiments described or shown herein. 
     
     
         6 . The method of  claim 1 , further comprising:
 providing an air chamber layer that is separate and moveable with respect to at least one other layer of the ICCES MPICA.   
     
     
         7 . The method of  claim 6 , wherein the air chamber layer performs a function in accordance with any of the embodiments described or shown herein. 
     
     
         8 . A system for an integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA) configured in accordance with any of the embodiments described or shown herein. 
     
     
         9 . The system of  claim 8 , further comprising: a die retention layer. 
     
     
         10 . The system of  claim 9 , wherein the die retention layer is configured in accordance with any of the embodiments described or shown herein. 
     
     
         11 . The system of  claim 10 , wherein the die retention layer includes one or more of:
 a plurality of die retention receptacles formed at a surface of the die retention layer by a three-dimensional printer;   each die retention receptacle having dimensions larger than a die size, and positioned to correspond to the placement of a corresponding die on a wafer;   each die retention receptacle having a bottom surface having a hole through which a pin is configured to extend, the pin attaching a piston having the die size, the piston included in a plurality of pistons;   wherein a first adhesive material is present on a backside of the wafer that contains a plurality of dies including the die, the first adhesive material configured to provide a sticking force having a value less than a second adhesive material of a target substrate;   wherein the wafer is placed on the die retention surface with the die facing outward, the piston is deployed upward to contact the first adhesive layer to secure the die onto a surface of the piston;   wherein the second adhesive material is an anisotropic adhesive film;   wherein the die retention layer and wafer are scribed by a laser to separate the dies of the wafer;   wherein the piston exerts a downward force that pulls on the separated die to pull the separated die into the die receptacle into contact with the anisotropic adhesive layer.   
     
     
         12 . The system of  claim 8 , further comprising: a push piston layer or an air chamber layer. 
     
     
         13 . The system of  claim 12 , wherein the push piston layer is configured in accordance with any of the embodiments described or shown herein. 
     
     
         14 . The system of  claim 13 , wherein the push piston layer includes at least one of:
 a plurality of chambers aligned with a plurality die receptacles of a die retention layer, each chamber including a first hole configured to receive a corresponding pin connected between a chamber and a corresponding die receptacle;   each chamber including a piston connected to the corresponding pin, a radius of the pin being less than a dimension of the chamber, each piston configured to move up and down, a total excursion being the same as the die thickness;   each chamber including a second hole that opens an air manifold configured to provide a first positive pressure to push the piston down to a die receptacle end, to push the piston up to a die underside surface when a wafer that includes a plurality of dies is positioned adjacent to the die retention layer;   the air manifold configured to provide a negative pressure to pull the piston up and away from the die receptacle end, to pull the piston down to a bottom of the die receptacle to bring the die into the die receptacle;   wherein, when a target substrate is brought into near contact proximity to the die receptacle surface, a positive pressure is applied by the air manifold to move the piston down to the die receptacle end, to push the chamber piston up and the die out of the die receptacle, to eject the die onto the substrate where the die is attached by an anisotropic adhesive material;   wherein an attachment force of the anisotropic adhesive material is configured to pull the die off of the piston; and   wherein a negative air pressure is induced by the air manifold to withdraw the piston into the die receptacle to leave the die attached to the substrate.   
     
     
         15 . The system of  claim 12 , wherein the air chamber layer is configured in accordance with any of the embodiments described or shown herein. 
     
     
         16 . The system of  claim 15 , wherein the air chamber layer includes at least one of:
 a plurality of air holes matched to a distribution of holes in a piston chamber layer, but at locations specific to a number of die of a wafer to be ejected at any one time, the number of die to be ejected at any one time being less than or equal to a total number of die of the wafer.   
     
     
         17 . A two-sided ID die configured in accordance with any of the embodiments described or shown herein. 
     
     
         18 . The two-sided ID die of  claim 17 , further comprising:
 a top surface that includes at least a first bonding pad; and   a bottom surface that includes at least a second bonding pad.   
     
     
         19 . The two-sided ID die of  claim 18 , wherein at least one of the top surface or the bottom surface includes a conductive adhesive that covers the top surface or the bottom surface.