Adhesive with tunable porosity and methods to support temporary bonding applications

Abstract

Compositions and methods are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 0.4, more preferably greater than 1.0, and most preferably greater than 2.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

What is claimed is: 
     
         1 . A temporary adhesive with tunable porosity used to affix a work unit onto a carrier substrate, whereby subsequent to a manufacturing process, the porosity allows the penetration of a liquid into the interfacial bond and releases the work unit without harm and without the need for a subsequent cleaning process. 
     
     
         2 . The temporary adhesive of  claim 1  is a composite mixture of a binder and filler. 
     
     
         3 . The temporary adhesive of  claim 2  wherein the binder comprises an organic resin of one or more chemical families. 
     
     
         4 . The temporary adhesive of  claim 3  wherein the organic resin comprises one or more from the group epoxy, acrylate, silicone, urethane, rubber, and engineering polymer. 
     
     
         5 . The temporary adhesive of  claim 4  wherein the engineering polymer comprises one or more from the group polyimide, polyamide, polyamideimide, polybenzimidazole, polybenzoxazole, polysulfone, polyethersulfone, polyphenylsulfone, polyarylether, polyetheretherketone, polyvinyidenedifluoride, cyclic olefin copolymer, polyethylene terphthalate, polybutylene terephthalate, polyacrylonitrile, polyaryletherketone, polyketoneketone, styrene-acrylonitrile, polycarbonate, polystyrene, polyvinylchloride, polyphenylene sulfide, polytrimethylene terephthalate, polyvinylidene chloride, acrylonitrile butadiene styrene, and liquid crystal polymer. 
     
     
         6 . The temporary adhesive of  claim 4  wherein a mixture of the resin contains one or more polymer reaction initiators. 
     
     
         7 . The temporary adhesive of  claim 6  wherein the initiators comprise one or more from the group organic acid, photoacid generator, photobase generator, organic amine, thermal free radical, and photo free radical producing. 
     
     
         8 . The temporary adhesive of  claim 2  wherein the filler comprises one or more of the from the group nanoparticle, nanofiber, nanometal, micro-fiber, micro-glass bead, micro-glass sphere, ceramic, cellulose, woven polyester, non-woven polyester, woven glass, non-woven glass, glass frit, ceramic frit, metal woven screen, and metal non-woven screen. 
     
     
         9 . The temporary adhesive of  claim 1  wherein a solid form of the work unit comprises a film or foil. 
     
     
         10 . The temporary adhesive of  claim 1  wherein a solid form of the work unit is produced from evaporation. 
     
     
         11 . The temporary adhesive of  claim 1  wherein a solid form of the work unit is produced from plasma deposition. 
     
     
         12 . The temporary adhesive of  claim 1  wherein a solid form of the work unit is produced from electrolytic deposition. 
     
     
         13 . The temporary adhesive of  claim 9  wherein the solid form of the work unit comprises one or more from the group metal, ceramic, glass, organic polymer, and composite. 
     
     
         14 . The temporary adhesive of  claim 10  wherein the solid form of the work unit comprises one or more from the group metal, ceramic, glass, organic polymer, and composite. 
     
     
         15 . The temporary adhesive of  claim 11  wherein the solid form of the work unit comprises one or more from the group metal, ceramic, glass, organic polymer, and composite. 
     
     
         16 . The temporary adhesive of  claim 12  wherein the solid form of the work unit comprises one or more from the group metal, ceramic, glass, organic polymer, and composite. 
     
     
         17 . A temporary adhesive with tunable porosity used to affix a work unit onto a carrier substrate, whereby subsequent to a manufacturing process, the porosity allows the penetration of a liquid into the interfacial bond and releases the work unit without harm and without the need for a subsequent cleaning process wherein the tunable porosity is improved by increasing the ratio of filler to binder and calculating the ratio as a mathematical number. 
     
     
         18 . The temporary adhesive of  claim 17  wherein the mathematical number for the filler to binder ratio is preferably >0.4. 
     
     
         19 . The temporary adhesive of  claim 18  wherein the mathematical number for the filler to binder ratio is more preferably >1.0. 
     
     
         20 . The temporary adhesive of  claim 19  wherein the mathematical number for the filler to binder ratio is most preferably >2.0. 
     
     
         21 . A manufacturing process using the temporary adhesive with tunable porosity used to affix a work unit onto a carrier substrate, whereby subsequent to a manufacturing process, the porosity allows the penetration of a liquid into the interfacial bond and releases the work unit without harm and without the need for a subsequent cleaning process wherein the tunable porosity is improved by increasing the ratio of filler to binder and calculating the ratio as a mathematical number, where the process is electronics. 
     
     
         22 . The manufacturing process of  claim 21  wherein the process comprises semiconductor and display.