US2016020340A1PendingUtilityA1
Increasing the Efficiency of Solar Cells By Transfer of Solder
Est. expiryAug 22, 2032(~6.1 yrs left)· nominal 20-yr term from priority
B23K 1/20H10F 77/211H10F 71/00H10F 77/215H01L 31/022433B23K 3/0638B23K 1/0016Y02E10/50B23K 2101/42
60
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Claims
Abstract
Embodiments relate to thickening a contact grid of a solar cell for increased efficiency. A mold containing soldering material is heated. The mold is aligned with the contact grid such that the soldering material is in physical contact with the contact grid. The mold is re-heated, transferring the solder material from the mold to the contact grid to create a thickened contact grid.
Claims
exact text as granted — not AI-modifiedWe claim:
1 . A solar cell comprising:
a diode comprised of an active layer in communication with a substrate; a contact grid embedded in the substrate and comprised of a conducting material in communication with the active layer, the contact grid having a first thickness; and the contact grid thickness to increase from the first thickness to a second thickness, the second thickness greater than the first thickness, the contact grid comprising solder pre-formed in a first mold, the solder to transfer from the first mold to the contact grid, including alignment of the first mold with the contact grid wherein the solder is in physical contact with the contact grid and heated until the solder is melted, detached from the first mold, and soldered to the contact grid to form the second thickness.
2 . The solar cell of claim 1 , wherein the mold is glass.
3 . The solar cell of claim 1 , wherein the solder is lead free.
4 . The solar cell of claim 1 , the contact grid further comprising a landing area, the solder placed in contact with the landing area when the mold is aligned with the contact grid.
5 . The solar cell of claim 1 , wherein the contact grid is embedded in the substrate via screen printing.Join the waitlist — get patent alerts
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