Heat exchanger

Abstract

A heat exchanger for cooling a battery and/or an electronic component, having a first plate element and a second plate element. The two plate elements each have their main extension directions along a plane spanned by two spatial directions, and a wall thickness along the third spatial direction is much smaller. The two plate elements are stacked on top of each other and at least one flow channel is provided between the two plate elements. The first plate element has a greater extension than the second plate element in the plane of the main extension directions. A projection over the second plate element is formed. The plate elements are soldered to each other along an edge region of the second plate element. The solder extends beyond the solder surface between the plate elements in the direction of the projection and in the direction of the center of the heat exchanger.

What is claimed is: 
     
         1 . A heat exchanger comprising:
 a first plate element;   a second plate element, the first and second plate elements each having their main extension directions along a plane spanned by two spatial directions and a wall thickness along a third spatial direction being smaller, the first and second plate elements being stacked on top of each other;   at least one flow channel formed between the first and second plate elements; and   a projection provided over the second plate element,   wherein the first plate element has a greater extension than the second plate element in the plane of the main extension directions,   wherein the first and second plate elements are soldered to each other along an edge region of the second plate element, the solder extending beyond a solder surface between the first and second plate elements in a direction of the projection as well as in a direction of a center of the heat exchanger.   
     
     
         2 . The heat exchanger according to  claim 1 , wherein the solder surrounds the second plate element along a narrow side forming the wall thickness on the side of the projection. 
     
     
         3 . The heat exchanger according to  claim 1 , wherein the solder, which extends beyond the solder surface on the side of the center of the heat exchanger, extends into the flow channel, and wherein the extension of the solder along the third spatial direction increases in the direction of the center of the heat exchanger. 
     
     
         4 . The heat exchanger according to  claim 1 , wherein the second plate element is fixed against the first plate element in a form-locked and integral manner along a plane of the main extension direction due to the solder on the side of the projection and the solder on the side of the center of the heat exchanger. 
     
     
         5 . The heat exchanger according to  claim 1 , wherein one of the plate elements has a recess that is covered by the other plate element, wherein the contact surface between the two plate elements being reduced in size by the cross-sectional area of the recess. 
     
     
         6 . The heat exchanger according to  claim 5 , wherein a shorter length of the contact surface, which results between the two plate elements without the provision of a recess, is at least greater than a double wall thickness of the thicker plate element, the shorter length of the contact surface being measured along the plane of the main extension directions. 
     
     
         7 . The heat exchanger according to  claim 5 , wherein the thicker plate element has the recess. 
     
     
         8 . The heat exchanger according to  claim 5 , wherein the plate element having the recess is soldered to the particular other plate element along an edge of the recess, wherein the narrow side extending along the third spatial direction is engaged by a solder region, and another solder region extending beyond the solder surface in the direction of the flow channel, and wherein the solder region along the third spatial direction has a greater extension than the solder surface. 
     
     
         9 . The heat exchanger according to  claim 1 , wherein a single flow channel or a plurality of flow channels is provided between the two plate elements, each flow channel being formed from the plane of the main extension directions by a trough-shaped region of at least one plate element. 
     
     
         10 . The heat exchanger according to  claim 9 , wherein a third planar plate element is disposed on the side of the plate element which has the trough-shaped region and faces away from the flow channel, wherein the third plate element has a greater extension in the plane of the main extension directions than the plate element which has the trough-shaped region, and wherein the third plate element forms a projection thereover. 
     
     
         11 . The heat exchanger according to  claim 10 , wherein the third plate element is soldered to the plate element which has the trough-shaped region, the solder extending beyond the contact surface between the first and second plate elements in the direction of the edge region of the third plate element, and the plate element which has the trough-shaped region engages along the third spatial direction.