Photosensitive coating resin of auxiliary plates for drilling and application thereof
Abstract
A photosensitive resin composition and auxiliary plates for drilling are introduced. The auxiliary plates are made by coating the photosensitive resin composition on aluminum foil and photocuring the coated resin to make the resin bonded on the aluminum foil. The resin composition comprises a first polymer formed by the reaction of 1,2,4,5-pyromellitic dianhydride and polyetheramine; and a second polymer formed by the reaction of polyetheramine and vinyl chloride, wherein the second polymer is a photosensitive polymer. The novel resin composition provided by the present invention can be coated on drilling auxiliary plates. When the drilling auxiliary plates coated with the resin composition are used in a drilling process, it can avoid the coated resin being cracked due to the heat caused by friction of high speed drilling, so it can further enhance the stability, accuracy, and precision of drilling.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A resin composition, comprising:
a first polymer formed by the reaction of 1,2,4,5-pyromellitic dianhydride and polyetheramine; and a second polymer formed by the reaction of polyetheramine and vinyl chloride, wherein the second polymer is a photosensitive polymer.
2 . The resin composition of claim 1 , wherein the first polymer has a structure of the following formula (I)
wherein n is an integer from 2 to 100, and m is an integer from 1 to 1000.
3 . The resin composition of claim 1 , wherein the second polymer has a structure of the following formula (II)
wherein o is an integer from 2 to 100.
4 . The resin composition of claim 1 , wherein further comprises an additive selected from the group consisting of photoinitiator, defoamants, leveling agents, and solvents.
5 . The resin composition of claim 2 , wherein further comprises an additive selected from the group consisting of photoinitiator, defoamants, leveling agents, and solvents.
6 . The resin composition of claim 3 , wherein further comprises an additive selected from the group consisting of photoinitiator, defoamants, leveling agents, and solvents.
7 . The resin composition of claim 4 , wherein the resin composition further comprises water-soluble resin.
8 . The resin composition of claim 5 , wherein the resin composition further comprises water-soluble resin.
9 . The resin composition of claim 6 , wherein the resin composition further comprises water-soluble resin.
10 . The resin composition of claim 4 , wherein the amount of the photoinitiator is 1 to 10% by weight of the total resin composition.
11 . The resin composition of claim 5 , wherein the amount of the photoinitiator is 1 to 10% by weight of the total resin composition.
12 . The resin composition of claim 6 , wherein the amount of the photoinitiator is 1 to 10% by weight of the total resin composition.
13 . A drilling auxiliary plate for printed circuit board, comprising:
a substrate; and a lubricating resin layer bonded on the substrate, wherein the lubricating resin layer is made by coating the resin composition of claim 1 on the substrate and curing the resin composition by illuminating or baking.
14 . The drilling auxiliary plate of claim 13 , wherein the substrate is aluminum foil.
15 . The drilling auxiliary plate of claim 14 , wherein the material of the aluminum foil is selected from the group consisting of pure aluminum, hard aluminum alloys, and semi-hard aluminum alloys.
16 . The drilling auxiliary plate of claim 15 , wherein the thickness of the aluminum foil is 0.03 mm to 0.30 mm.
17 . The drilling auxiliary plate of claim 16 , wherein the thickness of the aluminum foil is 0.02 mm to 0.25 mm.
18 . The drilling auxiliary plate of claim 13 , wherein the thickness of the lubricating resin layer is 0.01 mm to 0.40 mm.
19 . The drilling auxiliary plate of claim 18 , wherein the thickness of the lubricating resin layer is 0.02 mm to 0.25 mm.Cited by (0)
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