US2016035706A1PendingUtilityA1

Semiconductor device for battery power voltage control

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Assignee: RENESAS ELECTRONICS CORPPriority: Sep 19, 2008Filed: Oct 13, 2015Published: Feb 4, 2016
Est. expirySep 19, 2028(~2.2 yrs left)· nominal 20-yr term from priority
H10W 90/756H10W 90/754H10W 90/753H10W 90/752H10W 90/736H10W 90/732H10W 90/24H10W 90/20H10W 74/00H10W 72/07554H10W 72/07533H10W 72/5525H10W 72/5524H10W 72/5522H10W 72/5475H10W 72/5473H10W 72/5449H10W 72/5445H10W 72/5366H10W 72/5363H10W 72/983H10W 72/952H10W 72/934H10W 72/932H10W 72/926H10W 72/884H10W 72/536H10W 72/59H10W 44/206H10W 90/811H10W 74/129H10W 72/90H10W 72/00H10W 70/465H10W 20/20H10W 72/50H10W 90/00G06F 1/26H01L 25/0657H01L 23/3114H01L 2225/06506
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Claims

Abstract

A voltage generated in any of a plurality of semiconductor chips is supplied to another chip as a power supply voltage to realize a stable operation of a semiconductor device in which the semiconductor chips are stacked in the same package. For example, two chips are stacked with each other, first to third pads are disposed along corresponding sides of the respective chips, which are arranged close and in parallel to each other, and these pads are commonly connected to each other with first to third metal wires, respectively. In another example, fourth and fifth pads are disposed along a side different from a side along which the first to third pads are disposed, and further connected to each other with a fourth metal wire directly between the chips.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A semiconductor device, comprising:
 a first semiconductor chip having a first main surface over which a plurality of electrode pads are formed;   a second semiconductor chip having a second main surface over which a plurality of electrode pads are formed;   a plurality of external terminals; and   a sealing body sealing the first and second semiconductor chips,   wherein the first semiconductor chip includes:   a first electrode pad supplied with an external power supply voltage from a first external terminal;   a regulator circuit which is electrically connected with the first electrode pad and generates an internal power supply voltage by stepping down the external power supply voltage according to a reference voltage and an input voltage to be compared with the reference voltage; and   a second electrode pad which is electrically connected to the regulator circuit and from which the internal power supply voltage is output,   wherein the second semiconductor chip includes:   a third electrode pad to which the internal power supply voltage is input from the second electrode pad of the first semiconductor chip,   wherein the second and third electrode pads are electrically connected to a second external terminal via a first wire and a second wire, respectively,   wherein an end portion of the first wire is electrically connected to the second electrode pad,   wherein an end portion of the second wire is electrically connected to the third electrode pad, and   wherein another end portion of each of the first and second wires is electrically connected to the second external terminal.

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