US2016044779A1PendingUtilityA1
3-dimensional multi-layered modular computer architecture
Est. expirySep 6, 2025(expired)· nominal 20-yr term from priority
Inventors:Aviv Soffer
H10W 90/734H10W 90/724H10W 74/15Y02D10/00H05K 7/205H05K 1/0284G06F 2200/1635G06F 1/20G06F 1/18F28D 15/0275F28D 15/0266G06F 9/46G06F 1/26G06F 1/16H05K 2201/041H05K 1/185
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Claims
Abstract
A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.
Claims
exact text as granted — not AI-modified1 . A stackable layer having two large opposite surfaces, the stackable layer being usable for an apparatus such as a 3-Dimensional multi-layered modular computer, the stackable layer comprising: at least one encapsulated chip die; a set of electrical contacts at one of the large opposite surface of the layer; and a set of electrical contacts at the other large opposite surface of the layer; whereby said at least one encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.
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