Small form factor desktop computer

Abstract

An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a housing arranged to enclose and support a plurality of internal components, the housing including an upper enclosure and a lower enclosure coupled thereto, wherein the lower enclosure comprises:   a plurality of inlet vents;   a heat generating component located within the housing, the heat generating component; and   a fan assembly integrated within the lower enclosure and situated proximate the heat generating component.   
     
     
         2 . The electronic device of  claim 1 , further comprising a shroud that is coupled to the lower enclosure. 
     
     
         3 . The electronic device of  claim 2 , wherein the shroud directs airflow from one or more of the plurality of inlet vents to a fan assembly inlet. 
     
     
         4 . The electronic device of  claim 3 , further comprising a heat exchanger in thermal contact with the fan assembly. 
     
     
         5 . The electronic device of  claim 4 , further comprising a fin stack in thermal contact with the heat exchanger. 
     
     
         6 . The electronic device of  claim 5 , wherein airflow through the electronic device due to the operating fan assembly is directed across each of the fin stack and the heat exchanger. 
     
     
         7 . The electronic device of  claim 3 , wherein airflow through the electronic device due to operation of the fan assembly occurs in a lower portion of the housing. 
     
     
         8 . The electronic device of  claim 3 , wherein the lower enclosure acts as a foot for the electronic device. 
     
     
         9 . The electronic device of  claim 3 , wherein the lower enclosure is formed such that when it is coupled to the upper enclosure, the electronic device is supported by the lower enclosure. 
     
     
         10 . The electronic device of  claim 9 , wherein the airflow enters the shroud from and underside of the housing. 
     
     
         11 . A thermal flow assembly configured for use in an electronic device having a housing including an upper enclosure and a lower enclosure, the lower enclosure having a shroud, the thermal flow assembly comprising:
 a fan assembly including an inlet, an outlet and an impeller having a plurality of blades, wherein the shroud is configured to direct airflow to the impeller, wherein the fan assembly is integrated within an lower enclosure for the electronic device.   
     
     
         12 . The thermal flow assembly of  claim 11 , wherein the fan assembly further includes a fin stack and a heat pipe in thermal contact with the fan assembly. 
     
     
         13 . The thermal flow assembly of  claim 11 , wherein the shroud is configured to direct incoming airflow through the shroud to the impeller. 
     
     
         14 . The electronic device of  claim 13 , wherein airflow through the electronic device due to operation of the fan assembly occurs in a lower portion of the housing. 
     
     
         15 . The electronic device of  claim 11 , wherein the lower enclosure is formed such that when it is coupled to the upper enclosure, the electronic device is supported by the lower enclosure. 
     
     
         16 . The electronic device of  claim 13 , wherein the airflow enters the shroud from and underside of the housing. 
     
     
         17 . A method of cooling an electronic device, the method comprising:
 drawing ambient air into the electronic device through one or more inlet vents disposed at a lower housing of the electronic device;   directing the ambient air thru a shroud and into an impeller within the electronic device;   rotating the impeller to force the ambient air outward therefrom;   passing the ambient air through a fin stack, wherein heat is exchanged from one or more heated electronic device components to the ambient air via the fin stack; and   forcing the heated ambient air out of the electronic device through one or more outlet vents.   
     
     
         18 . The method of  claim 17 , wherein the shroud is coupled to the lower enclosure. 
     
     
         19 . The method of  claim 17 , wherein the ambient air is drawn into the electronic device from an underside of the housing. 
     
     
         20 . The method of  claim 17 , wherein the airflow directed through the electronic device is maintained in a lower portion of the housing.