Substrate processing apparatus

Abstract

A substrate processing apparatus, having a solidified material forming unit that discharges a solidification liquid in a liquid state from a nozzle and supplies the discharged solidification liquid to a substrate so as to form a solidified material of the solidification liquid on the substrate, and a remover that removes the solidified material of the solidification liquid on the substrate, wherein the solidified material forming unit supplies the solidification liquid having a solidification point higher than normal temperature to a top surface of the substrate, and the solidification liquid is solidified by an external stimulus received in either a process of landing on the substrate after being discharged from the nozzle, or a process of being left on the substrate as it is.

What is claimed is: 
     
         1 . A substrate processing apparatus, comprising:
 a solidified material forming unit that discharges a solidification liquid in a liquid state from a nozzle and supplies the discharged solidification liquid to a substrate so as to form a solidified material of the solidification liquid on the substrate; and   a remover that removes the solidified material of the solidification liquid on the substrate, wherein   the solidified material forming unit supplies the solidification liquid having a solidification point higher than normal temperature to a top surface of the substrate; and   the solidification liquid is solidified by an external stimulus received in at least one of a process of landing on the substrate after being discharged from the nozzle and a process of being left on the substrate as it is.   
     
     
         2 . The substrate processing apparatus according to  claim 1 , wherein:
 the solidified material forming unit supplies the solidification liquid to the top surface of the substrate, on which particles are adhered, to form the solidified material of the solidification liquid on the top surface of the substrate; and   the remover removes the solidified material of the solidification liquid on the top surface of the substrate to remove the particles with the solidified material of the solidification liquid.   
     
     
         3 . The substrate processing apparatus according to  claim 1 , wherein:
 the solidified material forming unit supplies the solidification liquid to the top surface of the substrate after heating it to a temperature equal to or higher than the solidification point of the solidification liquid.   
     
     
         4 . The substrate processing apparatus according to  claim 1 , further comprising:
 a solidification promoter that promotes solidification of the solidification liquid by supplying a cooling fluid having a temperature lower than the solidification point of the solidification liquid to the substrate.   
     
     
         5 . The substrate processing apparatus according to  claim 4 , wherein:
 the solidification promoter includes a first solidification promoting unit that supplies the cooling fluid to the top surface of the substrate to which the solidification liquid was supplied.   
     
     
         6 . The substrate processing apparatus according to  claim 4 , wherein:
 the solidification promoter includes a second solidification promoting unit that supplies the cooling fluid to an under surface of the substrate to which the solidification liquid was supplied.   
     
     
         7 . The substrate processing apparatus according to  claim 1 , wherein:
 the remover removes the solidified material after the solidification liquid is solidified after the elapse of a predetermined time following the supply of the solidification liquid to the top surface of the substrate.   
     
     
         8 . The substrate processing apparatus according to  claim 1 , wherein:
 the remover removes the solidified material by supplying a high-temperature removing liquid having a temperature higher than the solidification point of the solidification liquid to the top surface of the substrate formed with the solidified material.   
     
     
         9 . The substrate processing apparatus according to  claim 1 , wherein:
 the remover removes the solidified material by supplying a removing liquid, which dissolves the solidification liquid, to the top surface of the substrate formed with the solidified material.   
     
     
         10 . The substrate processing apparatus according to  claim 1 , further comprising:
 a cooler that cools the solidified material to reduce the temperature of the solidified material after the solidified material is formed and before the solidified material is removed.   
     
     
         11 . The substrate processing apparatus according to  claim 10 , wherein:
 the cooler includes a first cooling unit that supplies a cooling fluid having a temperature lower than the solidification point of the solidification liquid to the top surface of the substrate formed with the solidified material.   
     
     
         12 . The substrate processing apparatus according to  claim 10 , wherein:
 the cooler includes a second cooling unit that supplies a cooling fluid having a temperature lower than the solidification point of the solidification liquid to an under surface of the substrate formed with the solidified material.   
     
     
         13 . The substrate processing apparatus according to  claim 4 , wherein:
 the solidification promoter cools the solidified material by continuing to supply the cooling fluid until a time point before the solidified material is removed by the remover even after the solidified material is formed.   
     
     
         14 . The substrate processing apparatus according to  claim 1 , further comprising:
 a rinser that rinses the top surface of the substrate by supplying a rinsing liquid to the top surface of the substrate after the solidified material is removed by the remover.   
     
     
         15 . The substrate processing apparatus according to  claim 9 , wherein:
 the remover rinses the top surface of the substrate by continuing to supply the removing liquid even after the solidified material is removed.   
     
     
         16 . The substrate processing apparatus according to  claim 1 , further comprising a solidification preventer, wherein:
 the solidified material forming unit includes a solidification liquid supplier that supplies the solidification liquid and a pipe having one end connected to the solidification liquid supplier and the other end connected to the nozzle to cause the solidification liquid supplied from the solidification liquid supplier to flow to the nozzle; and   the solidification preventer prevents solidification of the solidification liquid in the nozzle and the pipe.   
     
     
         17 . The substrate processing apparatus according to  claim 16 , wherein:
 the solidification preventer keeps the temperature of the solidification liquid in the nozzle and the pipe equal to or higher than the solidification point of the solidification liquid.   
     
     
         18 . The substrate processing apparatus according to  claim 17 , wherein:
 the pipe includes an inner tube having one end connected to the solidification liquid supplier and the other end connected to the nozzle, and an outer tube into which the inner tube is inserted; and   the solidification preventer includes a temperature-retaining fluid supplier that supplies a temperature-retaining fluid having a temperature higher than that of the solidification liquid between the inner tube and the outer tube.   
     
     
         19 . The substrate processing apparatus according to  claim 16 , wherein:
 the solidification preventer includes a purging unit that discharges the solidification liquid in the nozzle and the pipe from a discharge port of the nozzle by supplying a purging fluid having a temperature higher than that of the solidification liquid to the one end of the pipe after the solidified material is formed by the solidified material forming unit.   
     
     
         20 . The substrate processing apparatus according to  claim 16 , wherein:
 the solidification preventer includes a suction and discharge unit that discharges the solidification liquid in the nozzle and the pipe from the one end of the pipe by applying a negative pressure to the one end of the pipe after the solidified material is formed by the solidified material forming unit.