US2016060731A1PendingUtilityA1

Aluminum alloy for die casting and manufacturing method thereof

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Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Sep 2, 2014Filed: Sep 1, 2015Published: Mar 3, 2016
Est. expirySep 2, 2034(~8.1 yrs left)· nominal 20-yr term from priority
B22D 17/00C22C 21/02B22D 21/04C22C 1/026
57
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Claims

Abstract

An aluminum alloy, comprising: 4.0 to 10.0 weight % silicon (Si), 0.1 to 4.0 weight % magnesium (Mg), 0.1 to 1.0 weight % chromium (Cr), 0.05 to 1.0 weight % zinc (Zn), 0.05 to 1.0 weight % manganese (Mn), 0.01 to 1.0 weight % titanium (Ti), 0.001 to 0.5 weight % tin (Sn), and 81.5 to 95.689 weight % aluminum and at least one impurity.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An aluminum alloy, comprising:
 4.0 to 10.0 weight % silicon (Si),   0.1 to 4.0 weight % magnesium (Mg),   0.1 to 1.0 weight % chromium (Cr),   0.05 to 1.0 weight % zinc (Zn),   0.05 to 1.0 weight % manganese (Mn),   0.01 to 1.0 weight % titanium (Ti),   0.001 to 0.5 weight % tin (Sn), and   81.5 to 95.689 weight % aluminum and at least one impurity.   
     
     
         2 . The aluminum alloy of  claim 1 , wherein the at least one impurity includes at least one of copper (Cu), nickel (Ni), and iron (Fe). 
     
     
         3 . The aluminum alloy of  claim 2 , wherein the copper (Cu) makes up at most 0.05 weight % of the alloy and the nickel (Ni) makes up at most 0.05 weight % of the alloy. 
     
     
         4 . The aluminum alloy of  claim 2 , wherein the iron (Fe) makes up at most 0.3 weight % of the alloy. 
     
     
         5 . The aluminum alloy of  claim 1 , further comprising 0.01 to 1.0 weight % zirconium (Zr). 
     
     
         6 . A method, comprising die casting an electronic device component from an aluminum alloy, wherein the alloy comprises 4.0 to 10.0 weight % silicon (Si), 0.1 to 4.0 weight % magnesium (Mg), 0.1 to 1.0 weight % chromium (Cr), 0.05 to 1.0 weight % zinc (Zn), 0.05 to 1.0 weight % manganese (Mn), 0.01 to 1.0 weight % titanium (Ti), and 0.001 to 0.5 weight % tin (Sn), and 81.5 to 95.689 weight % aluminum and at least one impurity. 
     
     
         7 . The method of  claim 6 , wherein the aluminum alloy is subjected to a casting temperature of 680 to 750° C. during the die casting. 
     
     
         8 . The method of  claim 6 , wherein the aluminum alloy is subjected to a casting pressure of 75 MPa during the die casting. 
     
     
         9 . The method of  claim 6 , wherein the aluminum alloy exhibits a tensile strength of 250 to 350 MPa. 
     
     
         10 . The method of  claim 6 , wherein the aluminum alloy exhibits a yield strength of 150 to 250 MPa. 
     
     
         11 . The method of  claim 6 , wherein the aluminum alloy is exhibits a break elongation of 2.0 to 4.5%. 
     
     
         12 . The method of  claim 6 , wherein the electronic device component includes at least one of an external housing, an internal housing, and a bezel of the electronic device. 
     
     
         13 . A method for manufacturing an aluminum alloy comprising:
 melting aluminum (Al) by heating the aluminum up to a temperature of 700° C. to 800° C.;   heating the melted aluminum (Al) to a temperature between 850° C. and 900° C. and adding silicon (Si) to the melted aluminum (Al) to produce a first intermediate alloy;   heating up the first intermediate alloy to a temperature of 1200° C. or less, and adding chromium (Cr), manganese (Mn), and titanium (Ti) to the first intermediate alloy to produce a second intermediate alloy;   cooling the second intermediate alloy to a temperature between 700° C. and 800° C. and adding zinc (Zn), and tin (Sn) to the second intermediate alloy to produce the aluminum alloy,   wherein the aluminum alloy comprises 4.0 to 10.0 weight % silicon (Si), 0.1 to 4.0 weight % magnesium (Mg), 0.1 to 1.0 weight % chromium (Cr), 0.05 to 1.0 weight % zinc (Zn), 0.05 to 1.0 weight % manganese (Mn), 0.01 to 1.0 weight % titanium (Ti), and 0.001 to 0.5 weight % tin (Sn), and 81.5 to 95.689 weight % aluminum and at least one impurity.   
     
     
         14 . The method of  claim 13 , further comprising adjusting the amount of the at least one impurity that is present in the alloy. 
     
     
         15 . The method of  claim 14 , wherein the at least one impurity includes at least one of copper (Cu), nickel (Ni), and iron (Fe). 
     
     
         16 . The method of  claim 15 , wherein the copper (Cu) makes up at most 0.05 weight % of the alloy and the nickel (Ni) makes up at most 0.005 weight % of the alloy. 
     
     
         17 . The method of  claim 15 , wherein the iron (Fe) makes up at most 0.3 weight % of the alloy. 
     
     
         18 . The method of  claim 13 , further comprising adding zirconium (Zn) to the first intermediate alloy, wherein the aluminum alloy further comprises 0.01 to 1.0 weight % zirconium (Zr).

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