Connection arrangement of an electric and/or electronic component

Abstract

A connection arrangement includes at least one electric and/or electronic component. The at least one electric and/or electronic component has at least one connection face, which is connected in a bonded manner to a join partner by means of a connection layer. The connection layer can for example be an adhesive, soldered, welded, sintered connection or another known connection that connects joining partners while forming a material connection. Furthermore, a reinforcement layer is arranged adjacent to the connection layer in a bonded manner. The reinforcement layer has a higher modulus of elasticity than the connection layer. A particularly good protective effect is achieved if the reinforcement layer is formed in a frame-like manner by an outer and an inner boundary and, at least with the outer boundary thereof, encloses the connection face of the at least one electric and/or electronic component.

What is claimed is: 
     
         1 . A connection arrangement ( 100 ,  200 ,  300 ,  400 ) of at least one electric and/or electronic component ( 10 ), wherein the at least one electric and/or electronic component ( 10 ) has a connection face ( 11 ), which is connected in a bonded manner to the join partner ( 40 ) by a connection layer ( 20 ), wherein
 a reinforcement layer ( 30 ′) is arranged adjacent to the connection layer ( 20 ), said reinforcement layer ( 30 ′) having a higher modulus of elasticity than the connection layer ( 20 ), wherein the reinforcement layer ( 30 ′) is formed in a frame-like manner by an outer boundary and an inner boundary ( 36 ,  35 ) and, at least with the outer boundary ( 36 ) thereof, encloses the connection face ( 11 ) of the at least one electric and/or electronic component ( 10 ), and   wherein the reinforcement layer ( 30 ′) comprises at least one intermetallic phase.   
     
     
         2 . The connection arrangement according to  claim 1 , characterized in that the connection layer ( 20 ) comprises at least one metal and the reinforcement layer ( 30 ′) is formed from a soldering material ( 30 ), wherein, after a thermal treatment of at least one of the connection layer ( 20 ) and the soldering material ( 30 ), the reinforcement layer ( 30 ′) comprises at least one intermetallic phase. 
     
     
         3 . The connection arrangement ( 100 ,  200 ,  300 ,  400 ) according to  claim 2 , characterized in that the soldering material ( 30 ) contains tin, bismuth, zinc, gallium and/or aluminum. 
     
     
         4 . The connection arrangement ( 100 ,  200 ,  300 ,  400 ) according to  claim 2 , characterized in that the inner boundary ( 35 ) of the reinforcement layer ( 30 ′) extends to within the connection face ( 11 ) of the at least one electric and/or electronic component ( 10 ). 
     
     
         5 . The connection arrangement according to  claim 4 , characterized in that the connection layer ( 20 ) has a surface region ( 21 ) which protrudes beyond the connection face ( 11 ), wherein the reinforcement layer ( 30 ′) is arranged on the connection layer ( 20 ) in said surface region ( 21 ) and/or the reinforcement layer ( 30 ′) delimits the lateral surface expansion of the connection layer ( 20 ) with the inner boundary ( 35 ) thereof. 
     
     
         6 . The connection arrangement ( 100 ,  200 ,  300 ,  400 ) according to  claim 5 , characterized in that the connection layer ( 20 ) is a metal layer containing tin, silver, copper, zinc, bismuth, gallium and/or aluminum. 
     
     
         7 . The connection arrangement ( 100 ,  200 ,  300 ,  400 ) according to  claim 6 , characterized in that the connection layer ( 20 ) is a silver sintered layer. 
     
     
         8 . The connection arrangement ( 100 ,  200 ,  300 ,  400 ) according to  claim 1 , characterized in that the inner boundary ( 35 ) of the reinforcement layer ( 30 ′) extends to within the connection face ( 11 ) of the at least one electric and/or electronic component ( 10 ). 
     
     
         9 . The connection arrangement according to  claim 1 , characterized in that the connection layer ( 20 ) has a surface region ( 21 ) which protrudes beyond the connection face ( 11 ), wherein the reinforcement layer ( 30 ′) is arranged on the connection layer ( 20 ) in said surface region ( 21 ) and/or the reinforcement layer ( 30 ′) delimits the lateral surface expansion of the connection layer ( 20 ) with the inner boundary ( 35 ) thereof. 
     
     
         10 . The connection arrangement ( 100 ,  200 ,  300 ,  400 ) according to  claim 1 , characterized in that the connection layer ( 20 ) is a metal layer containing tin, silver, copper, zinc, bismuth, gallium and/or aluminum. 
     
     
         11 . The connection arrangement ( 100 ,  200 ,  300 ,  400 ) according to  claim 1 , characterized in that the connection layer ( 20 ) is a silver sintered layer. 
     
     
         12 . A composite element, comprising a connection layer ( 20 ), which contains at least one metal, and a solder layer ( 30 ) arranged adjacent to the connection layer ( 20 ),
 characterized in that the solder layer ( 30 ) is formed in a frame-like manner by an outer boundary and an inner boundary ( 36 ,  35 ) and is arranged on at least one of the connection layer ( 20 ) and the solder layer ( 30 ), with the inner boundary ( 35 ) thereof, delimits a lateral surface expansion of the connection layer ( 20 ), wherein the composite element is designed in such a way that, during a thermal treatment of at least one of the connection layer ( 20 ) and the solder layer ( 30 ), a reinforcement layer ( 30 ′) comprising at least one intermetallic phase is formed between the connection layer ( 20 ) and the solder layer ( 30 ), the reinforcement layer ( 30 ′) having a higher modulus of elasticity than the connection layer ( 20 ).   
     
     
         13 . The composite element according to  claim 12 , characterized in that after the thermal treatment, at least the solder layer ( 30 ) is replaced by the reinforcement layer ( 30 ′). 
     
     
         14 . The composite element according to  claim 13 , characterized in that the solder layer ( 30 ) contains tin, bismuth, zinc, gallium and/or aluminum, and/or the connection layer ( 20 ) is a silver sintered layer or a silver sintered molded part. 
     
     
         15 . The composite element according to  claim 12 , characterized in that the solder layer ( 30 ) contains tin, bismuth, zinc, gallium and/or aluminum, and/or the connection layer ( 20 ) is a silver sintered layer or a silver sintered molded part. 
     
     
         16 . A joining method wherein a connection layer ( 20 ) is disposed between the connection face ( 11 ) of at least one electric and/or electronic component ( 10 ) and a join partner ( 40 ) in order to form a bonded connection, characterized in that a reinforcement layer ( 30 ′) is arranged adjacent to the connection layer ( 20 ), said reinforcement layer having a higher modulus of elasticity than the connection layer ( 20 ), wherein the reinforcement layer ( 30 ′) is formed in a frame-like manner by an outer boundary and an inner boundary ( 36 ,  35 ) and the connection face ( 11 ) is enclosed by at least the outer boundary ( 36 ) of the reinforcement layer ( 30 ′),
 characterized in that the connection layer ( 20 ) comprises at least one metal and the reinforcement layer ( 30 ′) is formed from a solder layer ( 30 ), wherein the solder layer ( 30 ) is formed in a frame-like manner by the outer boundary and the inner boundary ( 36 ,  35 ) and is applied to a surface region ( 21 ) of the connection layer ( 20 ), said surface region protruding beyond the connection face ( 11 ), and the solder layer ( 30 ) is arranged such that said solder layer, with the inner boundary ( 35 ) thereof, delimits lateral surface expansion of the connection layer ( 20 ), and at least one of the connection layer ( 20 ) and the solder layer ( 30 ) are thermally treated and the reinforcement layer ( 30 ′) is formed between the connection layer ( 20 ) and the solder layer ( 30 ), wherein the formed reinforcement layer ( 30 ′) has a higher modulus of elasticity than the connection layer ( 20 ) and wherein at least the solder layer ( 30 ) is replaced by the formed reinforcement layer ( 30 ′). 
 
     
     
         17 . The joining method according to  claim 16 , characterized in that the solder layer ( 30 ) is applied and/or disposed after the bonded connection of the at least one electric and/or electronic component ( 10 ) to the connection layer ( 20 ) has been formed. 
     
     
         18 . The joining method according to  claim 17 , characterized in that the connection layer ( 20 ) is configured as a silver sintered layer or silver sintered molded part. 
     
     
         19 . The joining method according to  claim 16 , characterized in that the solder layer ( 30 ) contains tin, bismuth, zinc, gallium and/or aluminum. 
     
     
         20 . The joining method according to  claim 16 , characterized in that the connection layer ( 20 ) is configured as a sintered layer or sintered molded part.