Organic light emitting diode display device and manufacturing method thereof

Abstract

An organic light emitting diode display device and a manufacturing method thereof are provided. The organic light emitting diode display device includes a first flexible substrate, a second flexible substrate, a first barrier layer, a second barrier layer, an organic light emitting diode element, and a metal enclosing wall. The first barrier layer is disposed on the first flexible substrate, and the second barrier layer is disposed on the second flexible substrate. The organic light emitting diode element is disposed between the first barrier layer and the second barrier layer. The metal enclosing wall connects the first flexible substrate to the second flexible substrate and surrounds the organic light emitting diode element.

What is claimed is: 
     
         1 . A display device, comprising:
 a first substrate, comprising a first region and a second region adjacent to the first region;   a first barrier layer disposed on the first substrate;   a second substrate;   a second barrier layer disposed on the second substrate;   a display element disposed between the first barrier layer and the second barrier layer;   a metal enclosing wall connecting the first substrate and the second substrate, wherein the display element and the metal enclosing wall are disposed on the first region; and   a flexible cable disposed out of the metal enclosing wall and bonded on the second region.   
     
     
         2 . The display device of  claim 1 , further comprising a microstructure disposed between the first substrate and the metal enclosing wall. 
     
     
         3 . The display device of  claim 2 , wherein the microstructure has a roughened surface. 
     
     
         4 . The display device of  claim 2 , wherein the microstructure has a plurality of pores, and a part of the metal enclosing wall is disposed in the pores of the microstructure. 
     
     
         5 . The display device of  claim 2 , wherein the microstructure prolongs the penetration paths for water and oxygen. 
     
     
         6 . The display device of  claim 2 , wherein the microstructure is disposed between the first barrier layer and the metal enclosing wall. 
     
     
         7 . The display device of  claim 6 , wherein the microstructure has a roughened surface. 
     
     
         8 . The display device of  claim 6 , wherein the microstructure has a plurality of pores, and a part of the metal enclosing wall is disposed in the pores of the microstructure. 
     
     
         9 . The display device of  claim 6 , wherein the microstructure prolongs the penetration paths for water and oxygen. 
     
     
         10 . The display device of  claim 1 , wherein the metal enclosing wall has a first thermal expansion coefficient, the first barrier layer has a second thermal expansion coefficient, and the first thermal expansion coefficient is different from the second thermal expansion coefficient. 
     
     
         11 . The display device of  claim 1 , wherein the first substrate is a transparent substrate. 
     
     
         12 . The display device of  claim 1 , wherein the flexible cable is bonded on the second region with a solder pad. 
     
     
         13 . The display device of  claim 1 , wherein the IC component is bonded on the second region.