Peripheral circuit of touch panel and manufacturing method thereof

Abstract

A method for manufacturing a peripheral circuit of a touch panel includes: printing a radiation curable conductive material on a substrate having a transparent conductive pattern; irradiating the radiation curable conductive material with a radiated ray, in order to cure parts of the radiation curable conductive material; and removing uncured parts of the radiation curable conductive material, in order to form the peripheral circuit.

What is claimed is: 
     
         1 . A method for manufacturing a peripheral circuit of a touch panel comprising:
 printing a radiation curable conductive material on a substrate having a transparent conductive pattern;   irradiating the radiation curable conductive material with a radiated ray, in order to cure parts of the radiation curable conductive material; and   removing uncured parts of the radiation curable conductive material, in order to form the peripheral circuit.   
     
     
         2 . The method of  claim 1 , wherein a wavelength of the radiated ray is approximately within a range from 230 nanometers to 600 nanometers. 
     
     
         3 . The method of  claim 1 , wherein the transparent conductive pattern is connected with the peripheral circuit. 
     
     
         4 . The method of  claim 1 , wherein a wire width of the peripheral circuit is less than or equal to about 70 micrometers. 
     
     
         5 . The method of  claim 1 , wherein the radiation curable conductive material comprises radiation curable silver glue, radiation curable silver paste or radiation curable ink. 
     
     
         6 . The method of  claim 1 , wherein the step of curing parts of the radiation curable conductive material comprises selectively curing the radiation curable conductive material by disposing a photomask on the radiation curable conductive material. 
     
     
         7 . The method of  claim 1 , wherein the radiated ray irradiates the radiation curable conductive material with at least two different wavelength ranges. 
     
     
         8 . The method of  claim 1 , wherein the radiation curable conductive material is printed on the substrate by screen printing. 
     
     
         9 . A method for manufacturing a peripheral circuit of a touch panel comprising:
 printing a photosensitive conductive material on a substrate by screen printing;   disposing a photomask on the photosensitive conductive material;   irradiating the photosensitive conductive material with a beam, in order to cure parts of the photosensitive conductive material; and   etching uncured parts of the photosensitive conductive material, in order to form the peripheral circuit.   
     
     
         10 . The method of  claim 9 , wherein the photosensitive conductive material comprises a plurality of silver particles. 
     
     
         11 . The method of  claim 10 , wherein a diameter of the plurality of silver particles is within a range from 1 micrometer to 10 micrometers. 
     
     
         12 . The method of  claim 9 , wherein a wire width of the peripheral circuit is less than 100 micrometers. 
     
     
         13 . The method of  claim 9 , further comprising:
 adhering the peripheral circuit to a flexible printed circuit board (FPC) by using a conductive adhesive, and the conductive adhesive is an anisotropic conductive film (ACF) or anisotropic conductive past (ACP).   
     
     
         14 . The method of  claim 9 , further comprising:
 disposing a protective film on the peripheral circuit.   
     
     
         15 . The method of  claim 14 , wherein the step of disposing the protective film on the peripheral circuit comprises disposing the protective film utilizing a pasting method or a printing method. 
     
     
         16 . The method of  claim 9 , wherein the beam comprises a visible light with a wavelength within a range from 350 micrometers to 780 micrometers.