Attenuation systems with cooling functions and related components and methods

Abstract

Attenuation systems have cooling components that produce power in response to heat generated by the attenuator. The cooling components can be used to power cooling fans if a primary power source of the fans fails.

What is claimed is: 
     
         1 . An attenuation system, comprising:
 an attenuator configured to attenuate signals from a radio frequency (RF) signal source;   a thermoelectric cooling component comprising a plurality of thermoelectric modules and configured to receive heat generated by the attenuator and to generate electrical current in response to the heat; and   a plurality of fans configured to receive the electric current and to cool the attenuator,   wherein the thermoelectric modules comprise a first p-type semiconductor of a first electron density and a second n-type semiconductor of a second electron density different than the first electron density.   
     
     
         2 . The attenuation system of  claim 1 , wherein the cooling device is coupled to a power source, and wherein the thermoelectric cooling component is configured to provide electric power to the cooling device upon failure of the power source. 
     
     
         3 . A method of cooling in a system comprising an attenuator configured to attenuate signals, a thermoelectric cooling component configured to receive heat generated by the attenuator, and a cooling device configured to cool the attenuator, the method comprising:
 receiving an electrical signal at the attenuation system;   attenuating the electrical signal in the attenuation system, wherein the attenuator generates heat in response to attenuating the electrical signal;   at a plurality of thermoelectric modules in the thermoelectric cooling component, generating electric current in response to the heat generation; and   in response to failure of a power source coupled to the cooling device, providing the electric current to the cooling device.   
     
     
         4 . The method of  claim 3 , wherein the electrical signal comprises an RF signal, the method further comprising providing the attenuated signal to a distributed communication comprising a plurality of remote units. 
     
     
         5 . The method of  claim 4 , wherein the thermoelectric modules each comprise a first p-type semiconductor of a first electron density and a second n-type semiconductor of a second electron density different than the first electron density. 
     
     
         6 . The method of  claim 4 , wherein the cooling device comprises at least one fan. 
     
     
         7 . An attenuation system, comprising:
 an attenuator configured to receive and attenuate signals from an electrical signal source; and   a thermoelectric cooling component comprising a plurality of thermoelectric modules, each thermoelecric module comprising a first semiconductor of a first electron density and a second semiconductor of a second electron density different than the first electron density, the thermoelectric modules being configured to absorb heat generated by the attenuator and to generate electrical current in response to the heat; and   a plurality of fans configured to receive electrical current from the thermoelectric cooling component and to cool the attenuator,   wherein the thermoelectric modules comprise a first semiconductor of a first electron density and a second semiconductor of a second electron density different than the first electron density.   
     
     
         8 . The attenuation system of  claim 7 , wherein the plurality of fans is coupled to a power source, and wherein the thermoelectric cooling component is configured to provide electric power to the cooling device when the power source fails. 
     
     
         9 . The attenuation system of  claim 8 , wherein the first semiconductor is a p-type semiconductor and the second semiconductor is an n-type semiconductor. 
     
     
         10 . A method of cooling in a system comprising an attenuator configured to attenuate signals, a thermoelectric cooling component configured to receive heat generated by the attenuator, and a cooling device comprising at least one fan configured to cool the attenuator, the method comprising:
 receiving an electrical signal at the attenuator;   attenuating the electrical signal in the attenuator, wherein the attenuator generates heat in response to attenuating the electrical signal;   at a plurality of thermoelectric modules in the thermoelectric cooling component, generating electric current in response to the heat generation;   receiving the electric current at the at least one fan; and   cooling the attenuator with the at least one fan.   
     
     
         11 . The method of  claim 10 , wherein the at least one fan is coupled to a power source, and wherein providing electrical current to the cooling device occurs in response to failure of the power source. 
     
     
         12 . The method of  claim 11 , wherein the thermoelectric modules comprise a first p-type semiconductor of a first electron density and a second n-type semiconductor of a second electron density different than the first electron density.