US2016094014A1PendingUtilityA1

Hybrid Silicon Lasers on Bulk Silicon Substrates

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Assignee: SHIN DONG-JAEPriority: Sep 30, 2014Filed: Aug 24, 2015Published: Mar 31, 2016
Est. expirySep 30, 2034(~8.2 yrs left)· nominal 20-yr term from priority
H01S 5/026H01S 5/227H01S 5/14G02B 2006/12061H01S 5/34306H01S 5/2232H01S 5/2031H01S 5/021G02B 2006/12121H01S 5/22H01S 5/141H01S 5/0422G02B 6/12H01S 5/1032H01S 5/3434H01S 5/34313
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Claims

Abstract

Hybrid silicon lasers are provided including a bulk silicon substrate, a localized insulating layer that extends on at least a portion of the bulk silicon substrate, an optical waveguide structure on an upper surface of the localized insulating layer. The optical waveguide structure includes an optical waveguide including a silicon layer. A lasing structure is provided on the optical waveguide structure.

Claims

exact text as granted — not AI-modified
1 . A hybrid silicon laser comprising:
 a bulk silicon substrate;   a localized insulating layer extending on at least a portion of a surface of the bulk silicon substrate;   an optical waveguide structure on a surface of the localized insulating layer and including an optical waveguide as a silicon layer; and   a lasing structure on the optical waveguide structure.   
     
     
         2 . The hybrid silicon laser of  claim 1 , wherein the localized insulating layer comprises a buried insulating layer buried in a bulk trench in the bulk silicon substrate. 
     
     
         3 . The hybrid silicon laser of  claim 1 , wherein the silicon layer comprises a crystallized silicon layer. 
     
     
         4 . The hybrid silicon laser of  claim 1 , wherein a center point of the optical waveguide is deviated from a center point of the localized insulating layer. 
     
     
         5 . The hybrid silicon laser of  claim 1 , wherein the lasing structure comprises a Group III-V semiconductor gain layer coupled to the optical waveguide structure. 
     
     
         6 . (canceled) 
     
     
         7 . The hybrid silicon laser of  claim 1 , wherein the lasing structure comprises one of a mesa type structure and a ridge type structure. 
     
     
         8 . The hybrid silicon laser of  claim 1 , wherein the lasing structure comprises a light-emitting composite layer and a clad layer that is formed on the light-emitting composite layer. 
     
     
         9 . The hybrid silicon laser of  claim 1 , wherein a buffer layer for crystal growth I provided on the optical waveguide structure. 
     
     
         10 . The hybrid silicon laser of  claim 1 , wherein a combining medium layer for combining the lasing structure and the optical waveguide structure is provided between the lasing structure and the optical waveguide structure. 
     
     
         11 . A hybrid silicon laser comprising:
 a bulk silicon substrate;   a localized insulating layer that extends on at least a portion of a surface of the bulk silicon substrate;   an optical waveguide structure on the bulk silicon substrate and the localized insulating layer; and   a lasing structure on the optical waveguide structure.   
     
     
         12 . The hybrid silicon laser of  claim 11 , wherein the optical waveguide structure comprises:
 a silicon layer on the bulk silicon substrate and the localized insulating layer;   an optical waveguide layer in the silicon layer; and   an optical waveguide defined by the optical waveguide layer.   
     
     
         13 . The hybrid silicon laser of  claim 12 , wherein the optical wave guide layer is in a trench at opposite sides of the optical waveguide in the silicon layer and includes a material layer having a refractive index lower than a refractive index of the silicon layer. 
     
     
         14 . (canceled) 
     
     
         15 . The hybrid silicon laser of  claim 11 , wherein the lasing structure comprises a light-emitting composite layer on the optical waveguide structure and a clad layer on the light-emitting composite layer. 
     
     
         16 . The hybrid silicon laser of  claim 15 , wherein the light-emitting composite layer comprises:
 a light-emitting layer configured to emit light;   a first separate confinement heterostructure layer between the optical waveguide structure and the light-emitting layer; and   a second separate confinement heterostructure layer on the light-emitting layer.   
     
     
         17 . The hybrid silicon laser of  claim 15 , wherein an electric connection layer is on the optical waveguide structure and between the light-emitting composite layer and the optical waveguide structure. 
     
     
         18 . The hybrid silicon laser of  claim 17 , wherein a buffer layer for crystal growth is provided between the optical waveguide structure and the electric connection layer. 
     
     
         19 .- 21 . (canceled) 
     
     
         22 . A hybrid silicon laser comprising:
 a bulk silicon substrate;   a localized insulating layer that extends on at least a portion of the bulk silicon substrate;   an optical waveguide structure comprising:
 a silicon layer on the bulk silicon substrate and the localized insulating layer; 
 an optical waveguide layer in the silicon layer; and 
 an optical waveguide defined by the optical waveguide layer; and 
 a lasing structure comprising:
 a first electric connection layer on the optical waveguide structure; 
 a light-emitting composite layer on the first electric connection layer; and 
 a clad layer on the light-emitting composite layer. 
 
   
     
     
         23 . The hybrid silicon laser of  claim 22 , wherein the optical waveguide layer comprises a gas layer in a trench in the silicon layer with respect to the optical waveguide. 
     
     
         24 .- 25 . (canceled) 
     
     
         26 . The hybrid silicon laser of  claim 22 , wherein a second electric connection layer is provided on the clad layer. 
     
     
         27 . The hybrid silicon laser of  claim 26 , wherein a first electric terminal and a second electric terminal are provided on each of the first electric connection layer and the second electric connection layer, respectively. 
     
     
         28 .- 33 . (canceled)

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