US2016104777A1PendingUtilityA1
Zero-Dimensional Electron Devices and Methods of Fabricating the Same
Est. expiryMay 26, 2034(~7.9 yrs left)· nominal 20-yr term from priority
Inventors:Yu-Chen Chang
H10P 14/3452H10P 14/3421H10P 14/3256H10P 14/3252H10P 14/3221H10P 14/2911H10P 14/22H10D 62/85H10D 62/8503H10D 62/8171H10D 62/8164H10D 62/854H10D 62/118H10H 20/8252H10H 20/8242H10H 20/825H10H 20/824H10H 20/815H10H 20/812H10H 20/811H10H 20/013H10F 77/1433H10D 62/814H01L 29/20H01L 33/305H01L 33/30H01L 33/12H01L 33/04H01L 33/325H01L 29/127H01L 29/157H01L 33/32H01L 29/207H01L 29/2003Y02E10/544B82Y 20/00
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Claims
Abstract
A semiconductor device comprises a substrate and quantum dots, wherein a peak emission of the quantum dots has a FWHM of less than 20 meV when the semiconductor is measured at a temperature of 4 Kelvin.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A semiconductor device, comprising:
a substrate; and doped quantum dots disposed on the substrate.
2 . The semiconductor device of claim 1 , further comprising a buffer layer disposed between the substrate and the doped quantum dots, wherein:
the buffer layer includes a group III material and a group V material; and the doped quantum dots include a group III material and a group V material.
3 . The semiconductor device of claim 2 , wherein the buffer layer includes GaAs and the doped quantum dots include GaAs.
4 . The semiconductor device of claim 1 , wherein the doped quantum dots are doped by a group II or group IV material.
5 . The semiconductor device of claim 4 , wherein the doped quantum dots are doped with carbon.
6 . The semiconductor device of claim 2 , wherein the buffer layer includes GaN or AlN, and the doped quantum dots include GaN.
7 . The semiconductor device of claim 6 , wherein the doped quantum dots are doped with carbon, silicon, or zinc.
8 . The semiconductor device of claim 2 , wherein the buffer layer includes GaAs and the doped quantum dots include GaSb.
9 . The semiconductor device of claim 8 , wherein the doped quantum dots are doped with carbon, silicon, or Pb.
10 . A semiconductor device, comprising:
a substrate; and doped quantum dots disposed on the substrate; wherein a photoluminescence spectrum of the doped quantum dots has single peak or more than one peak at a temperature less than or equal to room temperature.
11 . The semiconductor device of claim 10 , further comprising a buffer layer disposed between the substrate and the doped quantum dots, wherein:
the buffer layer comprises a group Ill material and a group V material, and the doped quantum dots comprise a group Ill material and a group V material.
12 . The semiconductor device of claim 11 , wherein the buffer layer includes GaAs and the doped quantum dots comprise GaAs.
13 . The semiconductor device of claim 10 , wherein the doped quantum dots are doped by a group II or group IV material.
14 . The semiconductor device of claim 13 , wherein the doped quantum dots are doped with carbon.
15 . The semiconductor device of claim 14 , wherein the photoluminescence spectrum of the doped quantum dots has single peak or more than one peak in the visible light range.
16 . The semiconductor device of claim 15 , wherein the photoluminescence spectrum of the doped quantum dots has single peak or more than one peak covering the range of wavelengths from about 620 nm to about 750 nm.
17 . The semiconductor device of claim 11 , wherein the buffer layer includes GaN or AlN, and the doped quantum dots include GaN.
18 . The semiconductor device of claim 17 , wherein the doped quantum dots are doped with carbon, silicon, or zinc.
19 . The semiconductor device of claim 11 , wherein the buffer layer includes GaAs and the doped quantum dots include GaSb.
20 . The semiconductor device of claim 19 , wherein the doped quantum dots are doped with carbon, silicon, or Pb.
21 . A semiconductor device, comprising:
a buffer layer disposed on a substrate, the buffer layer includes a group III material and a group V material; a group III-V material layer disposed on the buffer layer, and doped quantum dots embedded in the group III-V material layer, the doped quantum dots including a group III material and a group V material and being doped by a group II or group IV material.
22 . The semiconductor device of claim 21 , wherein the buffer layer includes GaAs and the doped quantum dots include GaAs.
23 . The semiconductor device of claim 22 , wherein the doped quantum dots are doped with carbon.
24 . The semiconductor device of claim 21 , wherein the buffer layer includes GaN or AlN, and the doped quantum dots include GaN.
25 . The semiconductor device of claim 24 , wherein the doped quantum dots are doped with carbon, silicon, or zinc.
26 . The semiconductor device of claim 21 , wherein the buffer layer includes GaAs and the doped quantum dots include GaSb.
27 . The semiconductor device of claim 26 , wherein the doped quantum dots are doped with carbon, silicon, or Pb.
28 . The semiconductor device of claim 21 , further comprising:
first superlattices interposed between the substrate and the group III-V material layer, wherein the first superlattices include a group III material and a group V material.
29 . The semiconductor device of claim 21 , further comprising:
second superlattices disposed on the group III-V material layer, wherein the second superlattices include a group III material and a group V material.Cited by (0)
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