Housing, electronic device using the same, and method for making the same

Abstract

A housing includes a metal base and a non-conductive member. The metal base has an internal surface and at least one gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap.

What is claimed is: 
     
         1 . A housing comprising:
 a metal base defining an internal surface and at least one gap; and   a non-conductive member covering at least a portion of the internal surface of the metal base, and the non-conductive member being formed on a bottom of the at least one gap.   
     
     
         2 . The housing as claimed in  claim 1 , wherein the at least one gap includes a plurality of gaps, the metal base is spaced by the gaps to form a plurality of metal sheets and at least one main body, the metal sheets and the at least one main body are all bonded with the non-conductive member. 
     
     
         3 . The housing as claimed in  claim 1 , wherein each gap receives one dielectric member, the dielectric member is connected with the non-conductive member. 
     
     
         4 . The housing as claimed in  claim 1 , wherein each gap has a width of about 0.02 mm to about 0.7 mm along a direction from an adjacent non-conductive member located at one side of a metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet. 
     
     
         5 . The housing as claimed in  claim 3 , wherein each dielectric member has a width of about 0.02 mm to about 0.7 mm along a direction from an adjacent non-conductive member located at one side of a metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet. 
     
     
         6 . The housing as claimed in  claim 3 , wherein each metal sheet has a width of about 0.15 mm to about 1.0 mm along a direction from an adjacent non-conductive member located at one side of a metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet. 
     
     
         7 . The housing as claimed in  claim 3 , wherein the internal surface of the metal base has a groove, the non-conductive member is received in the groove. 
     
     
         8 . The housing as claimed in  claim 7 , wherein a thickness of the metal base corresponding to the groove is about 0.3 mm to about 0.5 mm. 
     
     
         9 . The housing as claimed in  claim 3 , wherein the dielectric member is made of a resin, a rubber, or a ceramic. 
     
     
         10 . The housing as claimed in  claim 1 , wherein the metal base is made of the material selected from a group consisting of aluminium, aluminium alloy, magnesium, magnesium alloy, titanium, titanium alloy, copper and copper alloy. 
     
     
         11 . The housing as claimed in  claim 1 , wherein the non-conductive member is selected from a group consisting of polybutylene terephthalate, polyphenylene sulfide, polyethylene terephthalate, polyether ether ketone, polycarbonate, polyvinyl chloride polymer, polyurethane resin, epoxy, and polyurea resin. 
     
     
         12 . A method of making a housing comprising:
 providing a metal base, the metal base having an internal surface;   placing the metal base into a mold, liquid non-conductive material covering at least a portion of the internal surface of the metal base to form a non-conductive member at the at least a portion of the metal base;   cutting the metal base corresponding to the at least a portion of the metal base to form at least one gap, the non-conductive member being formed on a bottom of the gap; and   placing one dielectric member in one corresponding gap.   
     
     
         13 . The method as claimed in  claim 12 , wherein the method of making the housing further includes a step of thinning the thickness of at least a portion of the metal base by a thinning process before the forming of the non-conductive member to form a groove at the internal surface of the metal base, the non-conductive member is received in the groove. 
     
     
         14 . The method as claimed in  claim 12 , wherein the method of making the housing further includes a step of forming a protective layer on the metal base by a surface treating process after the forming the dielectric member, the dielectric layer has a thickness of about 10 μm to about 15 μm. 
     
     
         15 . An electronic device, comprising:
 a body;   a housing assembled on the body, the housing including a metal base and a non-conductive member, the metal base defining an internal surface and at least one gap, the non-conductive member covering at least a portion of the internal surface of the metal base, and the non-conductive member being formed on a bottom of the at least one gap; and   an antenna located inside the housing, the antenna corresponding to the at least one gap.   
     
     
         16 . The electronic device as claimed in  claim 15 , wherein the metal base is a part of the antenna and couples with the antenna.