Multilayer ceramic electronic component and method of manufacturing the same

Abstract

A multilayer ceramic electronic component includes an inner layer part comprising dielectric layers and internal electrodes that are alternately disposed; and cover parts disposed on upper and lower surfaces of the inner layer part. The cover parts contain a nickel metal.

What is claimed is: 
     
         1 . A multilayer ceramic electronic component comprising:
 an inner layer part comprising dielectric layers and internal electrodes that are alternately disposed; and   cover parts disposed on upper and lower surfaces of the inner layer part,   wherein the cover parts contain a nickel metal.   
     
     
         2 . The multilayer ceramic electronic component of  claim 1 , wherein the cover parts contain 0.18 to 19 wt % of the nickel metal, based on a total weight of the cover parts. 
     
     
         3 . The multilayer ceramic electronic component of  claim 1 , wherein the cover parts contain 1.8 to 9.5 wt % of the nickel metal, based on a total weight of the cover parts. 
     
     
         4 . The multilayer ceramic electronic component of  claim 1 , wherein, in across section of a ceramic body including the inner layer part and the cover parts in a width-thickness direction, 0.2142≦Aa/Ac≦0.4911, where Ac is an area of the ceramic body and Aa is an area in which the internal electrodes overlap. 
     
     
         5 . The multilayer ceramic electronic component of  claim 1 , wherein 1.826≦C/M≦4.686, where C is a thickness of each of the cover parts, and M is a margin of the inner layer part in a width direction. 
     
     
         6 . A method of manufacturing a multilayer ceramic electronic component, the method comprising steps of:
 preparing a plurality of first green sheets using a first dielectric slurry;   preparing a plurality of second green sheets using a second dielectric slurry containing nickel oxide particles;   forming internal electrode patterns on the first green sheets;   stacking the first and second green sheets to prepare a green sheet multilayer body; and   sintering the green sheet multilayer body to prepare a ceramic body including an inner layer part in which first dielectric layers and internal electrodes are alternately disposed, and cover parts disposed on upper and lower surfaces of the inner layer part.   
     
     
         7 . The method of  claim 6 , wherein the cover parts contain a nickel metal formed by reduction of the nickel oxide particles contained in the second green sheets during the sintering of the green sheet multilayer body. 
     
     
         8 . The method of  claim 6 , wherein the second dielectric slurry contains 0.1 to 10 wt % of the nickel oxide particles, based on a total weight of the second dielectric slurry. 
     
     
         9 . The method of  claim 6 , wherein the second dielectric slurry contains 1 to 5 wt % of the nickel oxide particles, based on a total weight of the second dielectric slurry. 
     
     
         10 . The method of  claim 6 , wherein the nickel oxide particles have a particle size of 50 nm to 200 nm. 
     
     
         11 . The method of  claim 6 , wherein the nickel oxide particles have a particle size of 100 nm to 150 nm. 
     
     
         12 . The method of  claim 6 , wherein, in a cross section of the ceramic body in a width-thickness direction, 0.2142≦Aa/Ac≦0.4911, where Ac is an area of the ceramic body, and Aa is an area in which the internal electrodes overlap. 
     
     
         13 . The method of  claim 6 , wherein 1.826≦C/M≦4.686, where C is a thickness of each of the cover parts, and M is a margin of the inner layer part in a width direction.