Modified epoxy resin composition used in high solids coating

Abstract

This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, a process making thereof and its application in low VOC high solids coating.

1 . A process for preparing the epoxy resin composition, the epoxy resin composition comprises the following resins based on the total weight of the epoxy resin composition,
 i. from 10% to 75% by weight of a liquid epoxy resin of formula (I):   
       
         
           
           
               
               
           
         
         wherein n is 0 or 1; each R is independently H or —CH 3 ; and R 1  is —C 15 H 25 , —C 15 H 27 , or —C 15 H 29 ; 
         ii. from 10% to 75% by weight of a compound of formula (V): 
       
       
         
           
           
               
               
           
         
         wherein n is 0 or 1; each R is independently H or —CH 3 ; and R 1  is —C 15 H 25 , —C 15 H 27 , or —C 15 H 29 ; and 
         iii. from 10% to 70% by weight of a compound of formula (VI): 
       
       
         
           
           
               
               
           
         
         wherein x is 1 or 2; each n is independently 0 or 1; each R is independently H or —CH 3 ; and R 11  by formula (VII): 
       
       
         
           
           
               
               
           
         
         wherein R 2  is independently H or a C 1 -C 15  alkyl or alkenyl group; 
         the method comprises admixing a liquid epoxy resin of formula (I) and a cardanol moiety. 
       
     
     
         2 . The process of  claim 1 , wherein the liquid epoxy resin of formula (I) comprises 60% to 95% by weight based on the total weight of the mixture of a diglycidyl ether of a bisphenol. 
     
     
         3 . The process of  claim 2 , wherein the diglycidylether of bisphenol is chosen from a group of the diglycidylether Bisphenol A, the diglycidylether Bisphenol F, and combinations thereof. 
     
     
         4 . The process of  claim 2 , wherein the liquid epoxy resin of formula (I) is in liquid state without adding any solvent. 
     
     
         5 . The process of  claim 1 , wherein the epoxy resin composition is optionally reacted with a dihydric phenol. 
     
     
         6 . The process of  claim 4 , wherein the dihydric alcohol is chosen from a group of cardanol, bisphenol A, bisphenol F, resorcinol, or combinations thereof. 
     
     
         7 . The process of  claim 1 , wherein a catalyst is optionally added. 
     
     
         8 . The process of  claim 7 , wherein the catalyst is selected from a group comprising a basic inorganic reagent, a phosphine, a quaternary ammonium compound, phosphonium reagents, tertiary amines, and combinations thereof. 
     
     
         9 . The process of  claim 8 , wherein the catalyst is triphenylphosphonium acetate. 
     
     
         10 . The process of  claim 1 , wherein the process is conducted in the absence of solvent. 
     
     
         11 . The process of  claim 1 , wherein the temperature ranges from 20° C. to 260° C.