Electroplating solution for tin or tin alloy, and use for same

Abstract

An object of the present invention is to solve a problem in filling of a blind via or a through-hole with a conventionally used plating solution for tin or tin alloy plating where the filling itself cannot be achieved well, or even if the filling itself could be achieved, it takes an extremely long time. The electroplating solution for tin or tin alloy capable of solving the problem includes the following components (a) and (b): (a) a carboxyl group-containing compound, and (b) a carbonyl group-containing compound, a content of the component (a) being 1.3 g/L or more, and a content of the component (b) being 0.3 g/L or more.

1 . An electroplating solution, comprising:
 tin ion,   a first compound comprising a carboxyl group, and   a second compound comprising a carbonyl group,   wherein a concentration of the first compound is 1.3 g/L or more, a concentration of the second compound is 0.3 g/L or more.   
     
     
         2 . The electroplating solution according to  claim 1 , wherein a molar ratio of the first compound to the second compound is 10 or less. 
     
     
         3 . The electroplating solution according to  claim 1 , wherein the first compound is at least one of methacrylic acid and acrylic acid. 
     
     
         4 . The electroplating solution according to  claim 1 , wherein the second compound is at least one selected from the group consisting of benzalacetone, naphthaldehyde, and chlorobenzaldehyde. 
     
     
         5 . The electroplating solution according to  claim 1 , which is employed to fill a blind via or a through-hole. 
     
     
         6 . A method for filling a blind via or a through-hole, the method comprising:
 electroplating a material comprising a blind via or a through-hole with the electroplating solution according to  claim 1  to fill the blind via or the through-hole.   
     
     
         7 . The method according to  claim 6 , further comprising:
 increasing a current density during the electroplating.   
     
     
         8 . A method for manufacturing an electronic circuit board, the method comprising:
 electroplating an electronic circuit board comprising a blind via or a through-hole with the electroplating solution according to  claim 1  to fill the blind via or the through-hole.   
     
     
         9 . A method for electroplating tin or a tin alloy, the method comprising:
 electroplating a material comprising a blind via or a through-hole with the electroplating solution according to  claim 1 .